Microstructural and textural evolutions in multilayered Ti/Cu composites processed by accumulative roll bonding

Abstract Ti/Cu multilayered composites were fabricated via accumulative roll bonding (ARB). During co-deformation of the constituent metals, the hard Ti layers necked preferentially and then fragmented with the development of shear bands. Transmission electron microscopy showed that with increasing ARB cycles, grains in Ti were significantly refined even though dynamic recrystallization has occurred. For Cu the significant grain refinement was only found within the shear banded region when the composite was processed after five ARB cycles. Due to the diffusion of Cu atoms into Ti at the heterophase interfaces, amorphization with a width less than 10 nm was identified even in the composite processed by one cycle. At higher ARB cycles, the width of amorphous region increased and intermetallic compounds CuTi appeared from the region. The lattice defects introduced at the heterophase interfaces under roll bonding was responsible for the formation of the nano-scaled compounds. X-ray diffraction showed that an abnormal { 11 2 ¯ 0 } fiber texture was developed in Ti layers, while significant brass-type textures were developed in Cu layers. Some orientations along the { 11 2 ¯ 0 } fiber favored the prismatic slip for Ti. Tensile tests revealed the elevated strength without a substantial sacrifice of ductility in the composites during ARB. The unique mechanical properties were attributed to the significantly refined grains in individual metals, the good bonding between the constituent metals, as well as the development of an abnormal { 11 2 ¯ 0 } fiber texture in Ti layers.