Graphene Membranes for Hall Sensors and Microphones Integrated with CMOS-Compatible Processes
Source abstract
Abstract
Graphene is a promising candidate for future electronic devices because of its outstanding electronic and mechanical properties. The high charge carrier mobility in graphene, particularly in substrate-free suspended form, suggests applications as Hall effect sensors. In addition, graphene membranes are highly desirable as pressure sensors or microphones. Here, suitable integration processes for freestanding graphene devices with standard CMOS processes are demonstrated. We propose a process flow for graphene membrane-based Hall sensors and microphones that is CMOS back end of the line compatible. The Hall sensors show mobilities up to 11900 cm2 V–1 s–1, which are higher than in germanium- and GaAs-based Hall sensors. Graphene-based microphones are resonance-free for frequencies up to 700 kHz, i.e., in the acoustic wave region, which is a unique advantage over conventional microelectromechanical (MEMS) microphones.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Graphene research and applications · Magnetic Field Sensors Techniques · Advanced Sensor and Energy Harvesting Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Infineon Technologies AG, Wernerwerkstrasse 2, 93049 Regensburg, Germany
Chair of Electronic Devices, RWTH Aachen University, Otto-Blumenthal-Straße 2, 52074 Aachen, Germany
Infineon Technologies AG, Am Campeon 1-15, 85579 Neubiberg, Germany
AMO GmbH, Otto-Blumenthal-Straße 25, 52074 Aachen, Germany
Funding
Bundesministerium f?r Bildung und Forschung · H2020 Future and Emerging Technologies
References (68)
Show source-provided references
1. 10.1126/science.113683610.1126/science.1136836 ↗
2. 10.1038/nnano.2011.7110.1038/nnano.2011.71 ↗
3. 10.1021/nl401352k10.1021/nl401352k ↗
4. 10.1557/mrs.2014.13810.1557/mrs.2014.138 ↗
5. 10.1021/acsami.6b0579110.1021/acsami.6b05791 ↗
6. 10.1021/acsnano.6b0253310.1021/acsnano.6b02533 ↗
7. 10.1088/2053-1583/aa57c610.1088/2053-1583/aa57c6 ↗
8. 10.1109/LED.2007.89166810.1109/LED.2007.891668 ↗
9. 10.1103/PhysRevLett.116.12680510.1103/PhysRevLett.116.126805 ↗
10. 10.1063/1.491732310.1063/1.4917323 ↗
11. 10.1039/C5NR08729E10.1039/C5NR08729E ↗
12. 10.1063/1.491989710.1063/1.4919897 ↗
13. 10.1007/978-3-319-05353-0_6010.1007/978-3-319-05353-0_60 ↗
14. 10.1038/s41598-017-12277-810.1038/s41598-017-12277-8 ↗
15. 10.1038/nnano.2010.17210.1038/nnano.2010.172 ↗
16. 10.1063/1.361139410.1063/1.3611394 ↗
17. 10.1063/1.350029510.1063/1.3500295 ↗
18. 10.1021/nn305306n10.1021/nn305306n ↗
19. 10.1103/PhysRevX.4.04101910.1103/PhysRevX.4.041019 ↗
20. 10.1021/acsami.7b1748710.1021/acsami.7b17487 ↗
21. 10.1088/2053-1583/2/4/04501310.1088/2053-1583/2/4/045013 ↗
22. 10.1073/pnas.150580011210.1073/pnas.1505800112 ↗
23. 10.1063/1.480697410.1063/1.4806974 ↗
24. 10.1109/FCS.2012.624374210.1109/FCS.2012.6243742 ↗
25. 10.1021/nl903133w10.1021/nl903133w ↗
26. Dehé, A.; Wurzer, M.; Füldner, M.; Krumbeim, U. The Infineon Silicon MEMS Microphone. In: AMA conferences. 2013; S 14–16.10.5162/sensor2013/A4.3 ↗
27. 10.1016/j.mee.2016.02.06510.1016/j.mee.2016.02.065 ↗
28. Shik A. Y. · 1995
29. 10.1007/BF0291989310.1007/BF02919893 ↗
30. 10.1016/j.sna.2014.02.02610.1016/j.sna.2014.02.026 ↗
31. 10.1016/0038-1101(66)90150-X10.1016/0038-1101(66)90150-X ↗
32. 10.1109/4.98242110.1109/4.982421 ↗
33. 10.1103/PhysRev.130.166710.1103/PhysRev.130.1667 ↗
34. 10.1109/ICSENS.2004.142638010.1109/ICSENS.2004.1426380 ↗
35. 10.1002/adma.20130494910.1002/adma.201304949 ↗
36. 10.1121/1.39073810.1121/1.390738 ↗
37. 10.1016/0250-6874(89)80038-110.1016/0250-6874(89)80038-1 ↗
38. 10.1109/14.9028510.1109/14.90285 ↗
39. 10.1109/14.3089510.1109/14.30895 ↗
40. 10.1121/1.39769910.1121/1.397699 ↗
41. 10.1016/0924-4247(90)85023-W10.1016/0924-4247(90)85023-W ↗
42. 10.1109/SENSOR.1991.14885710.1109/SENSOR.1991.148857 ↗
43. 10.1109/SENSOR.1991.14889810.1109/SENSOR.1991.148898 ↗
44. 10.1109/84.18639410.1109/84.186394 ↗
45. 10.1016/0924-4247(92)80128-P10.1016/0924-4247(92)80128-P ↗
46. 10.1016/0924-4247(92)80095-K10.1016/0924-4247(92)80095-K ↗
47. 10.1109/84.29432310.1109/84.294323 ↗
48. 10.1109/84.53662610.1109/84.536626 ↗
49. 10.1016/S0924-4247(97)80507-910.1016/S0924-4247(97)80507-9 ↗
50. 10.1016/0924-4247(96)01130-210.1016/0924-4247(96)01130-2 ↗
51. 10.1117/12.28450010.1117/12.284500 ↗
52. 10.1016/S0924-4247(97)01532-X10.1016/S0924-4247(97)01532-X ↗
53. 10.1016/S0924-4247(98)00092-210.1016/S0924-4247(98)00092-2 ↗
54. 10.1109/84.73534610.1109/84.735346 ↗
55. 10.1109/MEMSYS.1998.65982210.1109/MEMSYS.1998.659822 ↗
56. 10.1121/1.41313510.1121/1.413135 ↗
57. 10.1016/S0924-4247(00)00336-810.1016/S0924-4247(00)00336-8 ↗
58. 10.1109/MEMSYS.2001.90647410.1109/MEMSYS.2001.906474 ↗
59. 10.1016/S0924-4247(01)00582-910.1016/S0924-4247(01)00582-9 ↗
60. 10.1088/0960-1317/11/4/30510.1088/0960-1317/11/4/305 ↗
61. 10.1016/S0924-4247(02)00137-110.1016/S0924-4247(02)00137-1 ↗
62. 10.1109/JMEMS.2003.82026010.1109/JMEMS.2003.820260 ↗
63. Neumann, J. J.; Gabriel, K. J. A Fully-Integrated CMOS-MEMS Audio Microphone. In TRANSDUCERS ’03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664), 2003; Vol. 1, pp 230–233.
64. 10.1121/1.177161710.1121/1.1771617 ↗
65. 10.1109/MEMSYS.2005.145393110.1109/MEMSYS.2005.1453931 ↗
66. Füldner M. · Modellierung und Herstellung Kapazitiver Mikrofone in BiCMOS-Technologie · 2004
67. 10.1109/ESSDERC.2013.681887610.1109/ESSDERC.2013.6818876 ↗
68. 10.1038/s41563-019-0359-710.1038/s41563-019-0359-7 ↗