Advanced Multilayer Bonding Technology
Source abstract
Abstract
Continuously increasing requirements drive multilayer manufacturers to search for advanced manufacturing technologies and to evaluate new materials. This paper provides an insight into new multilayer bonding methods, improvements offered by laminators, and why to select high performance materials for special applications.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: 3D IC and TSV technologies · Electronic Packaging and Soldering Technologies · Manufacturing Process and Optimization
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Norplex Oak Europa, Wipperfürth, Germany
References (18)
Show source-provided references
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