Reliability of flip chips on FR-4 assembled with reduced process steps
Source abstract
Abstract
This paper discusses processes of flip chip on FR-4 using eutectic solder bumps with possible fewer process steps compared to the full assembly process. Some interesting results in terms of the reliability performance of flip chip on FR-4 assemblies using eutectic solder have been obtained after an almost-one-year temperature cycling test. The process steps of underfilling and curing of underfill can be omitted when a suitable epoxy is used for encapsulation. When underfill is conducted, encapsulation is not necessarily needed from a reliability point of view.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · VLSI and FPGA Design Techniques
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Affiliations
Nanyang Technological University, Singapore
References (5)
Show source-provided references
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5. Zhong, Z.W . and Goh, K.S. (1999), “Assembly and reliability of flip chip on various substrate materials”, Proceedings of 1st International Workshop on Electronics Materials and Packaging (EMAP ’99), Singapore, pp. 12-20.10.1108/ssmt.2000.21912bac.002 ↗