journal article·2001-09-01

ED photo resist technology becomes a manufacturing process

Walter G. Hertlein, Kent Törnkvist, Kevin Smith

Circuit World· Volume 27· Issue 3
Publisher page

Abstract

The ever-increasing miniaturization and integration of additional functions in the electronics industry – in particular in the next generation telecomm technologies – needs a paradigm shift in manufacturing technologies in order to achieve the results along the roadmaps of the industry. Handling of thin substrates, doing finest line circuitry, working on non-flat surfaces and having to protect metallized holes during etching processes, are asking for conformal resist coatings. Electrophoretically deposited positive working photo resists encompass these requirements. The principles of electrophoretic photo resists, the necessary equipment, the cooperation between customer, the supplier of process chemistry and the supplier of the equipment to start such a complex project, and start-up results of the new major production line for ED-resist in Europe are discussed.
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Research context

OpenAlex topics: Advancements in Photolithography Techniques

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Sigma-Holmstrands AB, Karlstad, Sweden and Rapperswil, Switzerland

PCB Technology Centre Ericsson Radio Systems AB, Kumla, Sweden

Shipley Ronal Europe, Coventry, UK

References (11)

Show source-provided references
1. Beal, S . (2000), Evaluating HDI Technologies for High-Bandwidth Applications, HDI, July.
2. Dammel, R . (1993), Diazo-naphthoquinone Based Resists, SPIE, Optical Engineering Press, Bellingham, WA.10.1117/3.2265072 ↗
3. Doubrava, J . et al. (1995), Positive-Working Electrodeposited Photoresist Enables High Density Patterns on Panel Plated Outerlayers, CircuTree, May.
4. Hayes, D.R . and White, C.S. (1969), “Electrodeposition of paint: deposition parameters”, Journal of Coating Technology, Vol. 41, August, pp. 461-71.
5. Hertlein, W.G . (1998), “Performance and limits of photolithographic technology. PCB manufacturing technology following microelectronics production technologies”, Proceedings EPC 1998 Wiesbaden, September/October, pp. 1.1.1-1.1.7.
6. Machu, W . (1978), Handbook of Electropainting Technology, Electrochemical Publications Ltd., pp. 1-3.
7. Miller · PCB Fab · 2000 · 23 · 87 ff
8. Nakahara, H . (1992), “Electrodeposition of primary photoresists”, Electronic Packaging and Production, February, pp. 66-8.
9. Steeper, J . (1990), Temperature Dependence of Coating Thickness for an Electrodeposited Acrylic Emulsion, University of Lowell, Lowell, MA.
10. Thompson, T . (2000a), Editor’s Column in HDI, July.
11. Thompson, T . (2000b), BlueTooth Gets Some Teeth with SOC, CSM and COC, HDI, June, p. 5.