Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting,and Vibration Conditions
Source abstract
Abstract
The mechanical and vibration responses of 225-pin, 324-pin and 396-pin PBGA(plastic ball grid array) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses of the solder joints have been determined by bending and twisting experiments. The effects of shipping and functional environmental stress factors on the vibration responses of the solder joints have been determined by out-of-plane vibration experiments and a mathematical analysis.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgy and Material Forming · Engineering and Materials Science Studies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Hewlett-Packard Company, Palo Alto, California, USA
References (8)
Show source-provided references
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