Design, fabrication, and characterization of electroless Ni–P alloy films for micro heating devices

Abstract In this work electroless nickel–phosphorous coatings were used as the micro heaters for scanning thermal microscopy. The deposition of Ni–P alloys not only simplified the microelectromechanical system fabrication steps but also provided flexibility in the tuning of the resistance of the heating elements. Ni–P films were plated on patterned silicon substrates and silicon with a silicon nitride film. The pre-deposition reactive ion etch (RIE) treatment caused a change in surface roughness that enhanced the adhesion of Ni–P coatings. Optimization of RIE parameters and pH values could achieve selective deposition of Ni–P, thus helped the lift-off of a serpentine circuit pattern. The chemical composition and microstructure of Ni–P films affect the electrical properties of micro heaters. Energy-dispersive X-ray spectroscopy identified the Ni–P composition and confirmed its insignificant level of oxidation. The high-temperature X-ray diffraction indicated that the as-deposited film was crystalline Ni, which later transformed into Ni3P at higher temperature. The resistivity of Ni–P films was tailored between 10− 5 and 10− 7 Ω m via a post-deposition annealing, which also obtained a stable temperature coefficient of resistance. Consequently, the performance of micro heaters could be designed with a high degree of flexibility.