article·1997-10-01

Electrical properties of Ti/TiN films prepared by chemical vapor deposition and their applications in submicron structures as contact and barrier materials

Jiumei Hu, Mahmoud Ameen, G. J. Leusink, D. J. Webb, J. T. Hillman

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OpenAlex topics: Metal and Thin Film Mechanics · Semiconductor materials and devices · Copper Interconnects and Reliability

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