article·2003-12-06

Investigation of the electrical properties and reliability of amorphous SiCN

C. W. Chen, Tien‐Chun Chang, Po‐Tsun Liu, T. M. Tsai, Hung‐Wen Huang, J. M. Chen, Chien-Hao Tseng, C. C. Liu, Tseung‐Yuen Tseng

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OpenAlex topics: Copper Interconnects and Reliability · Semiconductor materials and devices · Silicon Carbide Semiconductor Technologies

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