Comparison of various low dielectric constant materials
Source abstract
Abstract
Abstract To reduce the intrinsic resistance-capacitance delay of back-end-of-line (BEOL) interconnects in integrated circuits, low-dielectric-constant (low-k) materials with a dielectric constant (k)
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Research context
OpenAlex topics: Copper Interconnects and Reliability · Semiconductor materials and devices · Metal and Thin Film Mechanics
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References
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