Intrinsic stress effect on fracture toughness of plasma enhanced chemical vapor deposited SiNx:H films
Source abstract
Abstract
Abstract The apparent fracture toughness for a series of plasma enhanced chemical vapor deposition SiNx:H films with intrinsic film stress ranging from 300 MPa tensile to 1 GPa compressive was measured using nanoindentation. The nanoindentation results show the measured fracture toughness for these films can vary from as high as > 8 MPa⋅√m for films in compression to as low as
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced ceramic materials synthesis · Metal and Thin Film Mechanics · Advanced Surface Polishing Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.