Critical study of thermosonic copper ball bonding
Source abstract
Abstract
Copper wire is getting well accepted as a reliable design alternative to the gold wire in the wire bonding process. In the present study, the shear strength results of the copper ball bond show better performance than the gold bond. Additionally, microhardness results also confirm that Cu ball bonds reveal a higher hardness of 111 VHN than that of initial Cu ball (84 VHN). The increased shear strength and hardness can be rationalized based on the strain hardening process due to application of the ultrasonic energy. Microstructural study of the deformed ball confirms the presence of subdivided grains (or cells) of a few microns in size. In addition, slip bands inside the cells are also observed.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metal Forming Simulation Techniques · Material Properties and Processing
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (20)
Show source-provided references
1. Harman · 1997 · 1
2. Study on thermosonic ball bonding of copper and gold wires
3. Murali · Mater. Res. Bull. · 2003 · 38 · 63710.1016/S0025-5408(03)00004-7 ↗
4. EIA/JESD22-B116, Wire bond shear test method, EIA/Jedec Standard, Electronic Industries Alliance, Arlington, USA, 1998.
5. Melting and solidification of thin wires: a class of phase change problems with a mobile interface—II. Experimental confirmation10.1016/0017-9310(94)00294-6 ↗
6. Melting and solidification of thin wires: a class of phase change problems with a mobile interface—I Analysis10.1016/0017-9310(94)00293-5 ↗
7. Howe · 1997
8. Reed-Hill · 1994
9. FEM based studies of ultra-fine pitch wire bond process
10. Effects of ultrasound on deformation characteristics of metals10.1109/T-SU.1966.29367 ↗
11. Granato · J. Appl. Phys. · 1956 · 27 · 58310.1063/1.1722436 ↗
12. Feltahm · 1980
13. Suresh · 1998
14. Thompson · Philos. Mag. · 1956 · 1 · 11310.1080/14786435608238086 ↗
15. Basinski · Philos. Mag. · 1969 · 19 · 89910.1080/14786436908225856 ↗
16. Cell and band structures in cold rolled polycrystalline copper10.1179/mst.1991.7.12.1069 ↗
17. A comparison of the evolution of cold and hot deformation microstructures and textures in FCC metals, advances in hot deformation textures and microstructures
18. Dislocation plasticity in persistent slip bands10.1016/S0921-5093(00)00662-6 ↗
19. Cold deformation microstructures10.1179/mst.1990.6.11.1039 ↗
20. A constitutive description of the slip-twinning transition in metals, advances in twinning