The effect of the polishing pad treatments on the chemical-mechanical polishing of SiO2 films
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Diamond and Carbon-based Materials Research · Integrated Circuits and Semiconductor Failure Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (10)
Show source-provided references
1. O'Mara · Semicond. Int. · 1994 · 140
2. Patrick · J. Electrochem. Soc. · 1991 · 138 · 177810.1149/1.2085872 ↗
3. Kaufman · J. Electrochem. Soc. · 1991 · 138 · 346010.1149/1.2085434 ↗
4. Catalog of Rodel Products Inc., Scottsdale, CA, 1994.
5. 1993 · 4
6. Jairath · 1994 · 337 · 121
7. Jairath · 1993 · 531
8. Tomozawa · 1994 · 337 · 89
9. Sivaram · 1992 · 511
10. S. Morimoto and R.J. Patterson, US Patent No. 5104828, 1992.