article·2004-06-28

Low cycle fatigue models for lead-free solders

J.H.L. Pang, B.S. Xiong, T.H. Low

Publisher page

Abstract

Abstract Low cycle fatigue (LCF) tests for 95.5Sn–3.8Ag–0.7Cu and 99.3Sn–0.7Cu Pb-free solders were conducted for two conditions of 25 °C at 1 Hz and 125 °C at 0.001Hz. The effect of higher temperature and slower frequency reduces low cycle fatigue endurance. Low cycle fatigue models for 95.5Sn–3.8Ag–0.7Cu and 99.3Sn–0.7Cu Pb-free solders are presented in Coffin–Manson and Morrow models. Comparison with reported Pb-free solder low cycle fatigue properties provides an evaluation of the relative fatigue endurance of Pb-free and Pb-based solders.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Electromagnetic Compatibility and Noise Suppression

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References

Reference metadata was not supplied for this record.