Low cycle fatigue models for lead-free solders
Source abstract
Abstract
Abstract Low cycle fatigue (LCF) tests for 95.5Sn–3.8Ag–0.7Cu and 99.3Sn–0.7Cu Pb-free solders were conducted for two conditions of 25 °C at 1 Hz and 125 °C at 0.001Hz. The effect of higher temperature and slower frequency reduces low cycle fatigue endurance. Low cycle fatigue models for 95.5Sn–3.8Ag–0.7Cu and 99.3Sn–0.7Cu Pb-free solders are presented in Coffin–Manson and Morrow models. Comparison with reported Pb-free solder low cycle fatigue properties provides an evaluation of the relative fatigue endurance of Pb-free and Pb-based solders.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Electromagnetic Compatibility and Noise Suppression
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