journal article·1988-12

Temperature and thickness dependence of the resistivity of thin polycrystalline aluminium, cobalt, nickel, palladium, silver and gold films

J.W.C. De Vries

Thin Solid Films· Volume 167· Issue 1-2
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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: Copper Interconnects and Reliability · Semiconductor materials and devices · Surface and Thin Film Phenomena

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References (18)

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