Electroless copper deposition: A critical review

Abstract This paper reviews recent progress on electroless copper deposition, primarily on non-conducting substrate surfaces including glass, polymers and resins for applications in electrical and electronics products and services. The review focuses on the research of bath parameters that affect the film fabrication process which influences the physical, chemical and electrical properties of the deposits. Fundamental aspects underlying the coating process are described in detail with the aim of summarizing existing application and highlighting new areas for future research. Finally, a comparison between electroless and electrodeposition technology is presented in order to evaluate their suitability for industrial technologies.