journal article·2002-10

Thermal stresses in elastic multilayer systems

C.H. Hsueh

Thin Solid Films· Volume 418· Issue 2
Publisher page

Abstract

Thermal stresses in elastic multilayer systems have been previously modelled. However, because the displacement compatibility condition at interfaces between layers must be satisfied, the complexity in obtaining a closed-form solution increases with the number of layers in the system. As a result, existing analyses often adopt simplifications (e.g. assuming a constant elastic modulus throughout the system) to obtain closed-form solutions or are solved numerically by computer. The present study develops an analytical model, in which the complexity in obtaining a closed-form solution is independent of the number of layers and an exact closed-form solution can be concisely formulated. Specific results are calculated for elastic thermal stresses in (AlGa)As laser diodes, which consist of five layers. Also, the zero-order and the first-order approximations are formulated based on the exact closed-form solution, and their accuracy is examined. The acceptability of assuming a constant elastic modulus in the system in existing analyses is also discussed.
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Research context

OpenAlex topics: GaN-based semiconductor devices and materials · Semiconductor Quantum Structures and Devices · Semiconductor Lasers and Optical Devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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