Direct writing of copper conductive patterns by ink-jet printing

Abstract Ink-jet printing of metal nanoparticles is an attractive method for direct patterning conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a conductive ink containing copper nanoparticles as an alternative that is inexpensive conductive material. Copper particles with a size of 40–50 nm were synthesized by polyol process, from which the well-dispersed conductive ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the conductive lines using Cu conductive ink. The ink-jet printed copper patterns exhibited metal-like appearance and became highly conductive upon heat treatments. The resistivity of the film reached to 17.2 μΩ cm at 325 °C for 1 h in vacuum.