Testing device of fabric dynamic thermal conductivity based on MCU

In order to objectively evaluate the warm-cool feeling of fabric,a testing device is developed for testing fabric dynamic thermal conductivity based on MCU.The device simulates the heat exchange process when the clothing is in contact with body,and fabric dynamic heat transmitting property is characterized by real-time measuring the surface temperature of fabric with MCU.This paper analyzes the relation between the test parameters and the warm-cool feeling of fabrics,and explores the endothermic curves of cotton,wool,silk,and hemp by using the device.Experimental results indicated that the endothermic curve of textile raw materials varies with structural parameter.This testing device is suitable for objectively evaluation of the warm-cool feeling of fabric,and has good accuracy and reproducibility.