journal article·2008-07

Enabling Technologies for Electrical Circuits on a Woven Monofilament Hybrid Fabric

Ivo Locher, Gerhard Tröster

Textile Research Journal· Volume 78· Issue 7
Publisher page

Abstract

Electronic Fabrics is an emerging topic in the field of Smart Textiles. This paper discusses potential technologies to embed electronic circuits into fabrics. Our approach focused on a woven fabric with unobtrusively embedded copper wires that guaranteed usual wearing comfort. Manufacturing, electrical, as well as mechanical aspects of our technologies, were addressed. We explain how interconnects and wiring structures were established within the fabric. Wiring structures were specified by DC resistance, frequency response and line impedance Z 0 . Our measurements revealed flat frequency responses up to 2 GHz and line impedances in the range of 250 Ω for textile transmission lines. Eventually, we showed that our fabric equipped with electronics withstood the tensile stresses and humidity impacts of daily usage. The presented technologies allow realization and wiring of medium-sized electronic circuits on fabrics with signal frequencies up to several 100 MHz.
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Research context

OpenAlex topics: Electromagnetic wave absorption materials · Advanced Sensor and Energy Harvesting Materials · Advanced Antenna and Metasurface Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Institute for Electronics, ETH Zürich, Switzerland,

Institute for Electronics, ETH Zürich, Switzerland

References (25)

Show source-provided references
1. Paradiso, R.
2. Wade, E.R.
3. Mann, S. · Technol · 1997 · 4 · 203
4. 10.1177/00405175040740101110.1177/004051750407401011 ↗
5. 10.1177/00405175040740110310.1177/004051750407401103 ↗
6. 10.1147/sj.393.084010.1147/sj.393.0840 ↗
7. Zollo, J.A. · 2005
8. Tektronix Inc.
9. IPA-510 Interconnect Parameter Analyzer, Reference Mannual, Tektronix Inc. (1992).
10. Agilent Technologies Inc.
11. 10.1109/75.48107710.1109/75.481077 ↗
12. 10.1109/22.8538810.1109/22.85388 ↗
13. 10.1109/LMWC.2003.81569510.1109/LMWC.2003.815695 ↗
14. 10.1109/22.4102910.1109/22.41029 ↗
15. 10.1109/75.65864010.1109/75.658640 ↗
16. 10.1109/TADVP.2003.81732910.1109/TADVP.2003.817329 ↗
17. Lo, W.-T. · IEEE MTTS Int. Microw. Symp · 1994 · 1 · 473
18. 10.1109/96.61823110.1109/96.618231 ↗
19. Tummala, R.R. · 1997
20. Agilent Technologies Inc.
21. 10.1177/00405175050750020410.1177/004051750507500204 ↗
22. Emerson and Cuming
23. 10.1109/33.8732510.1109/33.87325 ↗
24. Keithley Inc.
25. Agilent Technologies Inc.