DC conductance of CuPc films prepared by plasma activated evaporation
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Abstract
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Research context
OpenAlex topics: Copper Interconnects and Reliability · Electronic Packaging and Soldering Technologies · Nanomaterials and Printing Technologies
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References (2)
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1. Wagner · J. Mater. Sci. · 1982 · 17 · 278110.1007/BF00644652 ↗
2. Gutmann · 1967