journal article·2019-01-22Open access

Soft Three-Dimensional Microscale Vibratory Platforms for Characterization of Nano-Thin Polymer Films

Kewang Nan, Heling Wang, Xin Ning, Kali A. Miller, Chen Wei, Yunpeng Liu, Haibo Li, Yeguang Xue, Zhaoqian Xie, Haiwen Luan, Yihui Zhang, Yonggang Huang, John A. Rogers, Paul V. Braun

ACS Nano· Volume 13· Issue 1

Abstract

Vibrational resonances of microelectromechanical systems (MEMS) can serve as means for assessing physical properties of ultrathin coatings in sensors and analytical platforms. Most such technologies exist in largely two-dimensional configurations with a limited total number of accessible vibration modes and modal displacements, thereby placing constraints on design options and operational capabilities. This study presents a set of concepts in three-dimensional (3D) microscale platforms with vibrational resonances excited by Lorentz-force actuation for purposes of measuring properties of thin-film coatings. Nanoscale films including photodefinable epoxy, cresol novolak resin, and polymer brush with thicknesses as small as 270 nm serve as the test vehicles for demonstrating the advantages of these 3D MEMS for detection of multiple physical properties, such as modulus and density, within a single polymer sample. The stability and reusability of the structure are demonstrated through multiple measurements of polymer samples using a single platform, and via integration with thermal actuators, the temperature-dependent physical properties of polymer films are assessed. Numerical modeling also suggests the potential for characterization of anisotropic mechanical properties in single or multilayer films. The findings establish unusual opportunities for interrogation of the physical properties of polymers through advanced MEMS design.
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Research context

OpenAlex topics: Mechanical and Optical Resonators · Advanced MEMS and NEMS Technologies · Force Microscopy Techniques and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Mechanical Science and Engineering, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States

Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, and Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States

Department of Aerospace Engineering, Pennsylvania State University, State College, Pennsylvania 16802, United States

Department of Chemistry, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States

School of Naval Architecture, Ocean and Civil Engineering (State Key Laboratory of Ocean Engineering), Shanghai Jiaotong University, Shanghai 200000, China

Center for Flexible Electronics Technology and Center for Mechanics and Materials; AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China

Center for Bio-Integrated Electronics, Department of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering, and Computer Science, and Neurological Surgery, Simpson Querrey Institute for Nano/biotechnology, McCormick School of Engineering, and Feinberg School of Medicine, Northwestern University, Evanston, Illinois 60208, United States

Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, and Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States

Funding

Basic Energy Sciences · Tsinghua National Laboratory for Information Science and Technology · Division of Graduate Education · Division of Civil, Mechanical and Manufacturing Innovation · National Natural Science Foundation of China · International Institute for Nanotechnology, Northwestern University

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