journal article·2022-02Open access

Copper telluride thin films for gas sensing applications

Department of Physics, College of Education for Pure Science (Ibn-Alhaitham), University of Baghdad -Iraq, S. H. Salman, N. A. Hassan, Department of Physics, College of Education for Pure Science (Ibn-Alhaitham), University of Baghdad -Iraq, G. S. Ahmed, Department of Physics, College of Education for Pure Science (Ibn-Alhaitham), University of Baghdad -Iraq

Chalcogenide Letters· Volume 19· Issue 2

Abstract

Copper Telluride Thin films of thickness 700nm and 900nm, prepared thin films using thermal evaporation on cleaned Si substrates kept at 300K under the vacuum about (4x10-5 ) mbar. The XRD analysis and (AFM) measurements use to study structure properties. The sensitivity (S) of the fabricated sensors to NO2 and H2 was measured at room temperature. The experimental relationship between S and thickness of the sensitive film was investigated, and higher S values were recorded for thicker sensors. Results showed that the best sensitivity was attributed to the Cu2Te film of 900 nm thickness at the H2 gas.
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Research context

OpenAlex topics: Chalcogenide Semiconductor Thin Films · Gas Sensing Nanomaterials and Sensors · ZnO doping and properties

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References (18)

Show source-provided references
1. "[1] W. H. Brattain, J. Bardeen, Bell Syst. Tech. J. 32, 1 (1953).10.1002/j.1538-7305.1953.tb01420.x ↗
2. [2] Artur Rydosz, J. Coatings 8, 425 (2018).10.3390/coatings8120425 ↗
3. [3] V. J. Fulari, V. P. Malekar, S. A. Gangawane, J. Progress in Electromagnetics Research C 12, 53 (2010).10.2528/PIERC09103002 ↗
4. [4] K. Neyvasagam, N. Soundararajan, G. Ajaysoni, S. Okram, V. Ganesan, Physica Status Solidi B 245, 77 (2007).10.1002/pssb.200743111 ↗
5. [5] S. J. Fonash, Solar Cells Device Physics, 78, Academic Press, San Diego, 1981.
6. [6] H. M. Pathan, C. D. Lokhande, Bull. Mater. Sci. 27, 85 (2004).10.1007/BF02708491 ↗
7. [7] K. Neyvasagam, G. Muralidharan, V. Vasu, N. Soundararajan, J. AIP Conf. Proc. 1004, 182 (2008).
8. [8] Habib M. Pathan, Chandrakant Lokhande, D. P. Amalnerkar, Tanay Seth, J. Applied Surface Science 218(1-4), 291 (2003).
9. [9] S. S. Dhasade, S. H. Han, V. J. Fulari, J. Semiconductors 33, (2012)10.1088/1674-4926/33/9/093002 ↗
10. [10] P.V. Bhuvaneswari, K. Ramamurthi, R. Ramesh Babu, J. Thin Solid Films 632, 44 (2017).10.1016/j.tsf.2017.04.035 ↗
11. [11] Ya Yang, Taowen Wang, Cai, Liu, Wei, Li, Jingquan Zhang, Lili Wu, Guanggen Zeng, Wenwu Wang, Mingzhe Yu, J. Vacuum, 181 (2017)10.1016/j.vacuum.2017.05.014 ↗
12. [12] K. Neyvasagam, N. Soundararajan, Ajaysoni, G. S. Okram, J. I. P. S. S. 245, 77 (2008).10.1002/pssb.200743111 ↗
13. [13] S. H. Salman, A. A. Shihaba, A. Kh. Elttaye, J. Energy Proceda 157, 199 (2019).10.1016/j.egypro.2018.11.181 ↗
14. [14] A. A. Shehab, S. H. Salman, J. Ibn Al-Haitham for Pure and Applied Science 25(1), (2012).
15. [15] S. Hussain, M.Sc. thesis, Inkpoing university, (2008).
16. [16] G. B. Williamson, R. C. Smallman, philos. Mag. 1, 34 (1956).10.1080/14786435608238074 ↗
17. [17] S. S. Çetin, C. M. Baleanu, R. R. Nigmatullin, D. Baleanu, S. Özçelik, Thin Solid Films Journal 519(16), 5712 (2011).10.1016/j.tsf.2011.04.021 ↗
18. [18] S. H. Salman, A. A. Shihaba, A. Kh. Elttaye, Energy Procedia 157, 283 (2019)."10.1016/j.egypro.2018.11.192 ↗