journal article·2025-05

Role of amino acid-based inhibitors in the dynamic electrochemical behavior of Cu and Co during chemical mechanical planarization

Thi Thuy Hoang Tran, Mansour Moinpour, Ashwani Rawat, Elizabeth J. Podlaha, Jihoon Seo

Publisher page

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Advanced Surface Polishing Techniques · Advanced Machining and Optimization Techniques · Metal and Thin Film Mechanics

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (69)

Show source-provided references
1. BEOL Cu CMP process evaluation for advanced technology nodes. 2013. https://doi.org/10.1149/2.042312jes.10.1149/2.042312jes ↗
2. Chemical mechanical planarization: slurry chemistry
3. Seo, J.A. Review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization. 2017. https://doi.org/10.1557/s43578-020-00060-x.10.1557/s43578-020-00060-x ↗
4. Effect of 2-phosphonobutane-1, 2, 4-tricarboxylic acid (PBTCA) on Cu/Ta chemical mechanical planarization (CMP) in the barrier layer: a novel complexing agent and the dual role on Cu
5. Study on the synergistic effect and mechanism of inhibitors benzotriazole and pyrazole on copper surface10.1007/s10800-023-01874-3 ↗
6. Stress migration and electromigration improvement for copper dual damascene interconnection10.1149/1.1828419 ↗
7. Three anionic surfactants for corrosion inhibition in cobalt CMP: research on validity and mechanism
8. Environmentally friendly amino acid-based polishing slurry with reduced galvanic corrosion at copper/cobalt interface for advanced Cu interconnect applications
9. Post-CMP cleaning solutions for the removal of organic contaminants with reduced galvanic corrosion at copper/cobalt interface for advanced Cu interconnect applications10.1149/2.0011908jss ↗
10. A material removal model for silicon oxide layers in chemical mechanical planarization considering the promoted chemical reaction by the down pressure10.1016/j.triboint.2015.09.008 ↗
11. Principles of lubrication10.1533/9780857096326.10 ↗
12. Experimental strategies for studying tribo-electrochemical aspects of chemical–Mechanical planarization10.3390/lubricants12020063 ↗
13. Mechanism of copper removal during CMP in acidic H[Sub 2]O[Sub 2] slurry10.1149/1.1648029 ↗
14. Physical properties obtained from measurement model analysis of impedance measurements10.1016/j.electacta.2020.136747 ↗
15. Tribo-chemical behavior of copper in chemical mechanical planarization10.1007/s11249-013-0110-5 ↗
16. A quick diagnostic method for corrosion-inhibition balance and a green slurry for copper chemical mechanical polishing
17. Characterization of 1, 2, 4-triazole as corrosion inhibitor for chemical mechanical polishing of cobalt in H2O2 based acid slurry10.1149/2.0131905jss ↗
18. Tribo-electrochemical investigation of a slurry composition to reduce dissolution and galvanic corrosion during chemical mechanical planarization of Cu-Ru interconnects10.1016/j.matchemphys.2017.08.052 ↗
19. Experimental and computational studies on TAD as an additive of copper chemical mechanical polishing
20. Tailored alumina coatings for corrosion inhibition considering the synergism between phosphate ions and benzotriazole10.1016/j.jallcom.2019.153566 ↗
21. Electron donor-induced electrochemical reduction in vanadate anions to enhance the electrochemical performance of plasma electrolytic oxidation layers10.3390/met14060606 ↗
22. Highly corrosion-resistant and photocatalytic hybrid coating on AZ31 Mg alloy via plasma electrolytic oxidation with organic-inorganic integration10.1016/j.jma.2024.11.027 ↗
23. Corrosion inhibition behavior of new synthesized nonionic surfactants based on amino acid on carbon steel in acid Media10.1016/j.molliq.2016.03.048 ↗
24. Amino acids: chemistry and classification
25. The long and successful journey of electrochemically active amino acids. From fundamental adsorption studies to potential surface engineering tools10.1590/0001-3765201720170434 ↗
26. Theoretical evaluation of some α-amino acids for corrosion inhibition of copper in acidic medium: DFT calculations, Monte Carlo simulations and QSPR studies10.1016/j.jksus.2018.04.004 ↗
27. Amino acids as copper corrosion inhibitors: a density functional theory approach10.1016/j.apsusc.2020.145905 ↗
28. Review of corrosive environments for copper and its corrosion inhibitors10.1016/j.arabjc.2017.05.021 ↗
29. Heteroatom-based compounds as sustainable corrosion inhibitors: an overview
30. Effect of cystine in alkaline CMP slurry on controlling the galvanic corrosion at Al-Co interface10.1149/2.0071910jss ↗
31. The use of amino acids as corrosion inhibitors for metals: a review10.1016/j.ejpe.2018.04.004 ↗
32. Examining amino acids as environmentally friendly corrosion inhibitors for Cu and Co chemical mechanical planarization10.1016/j.jece.2024.113669 ↗
33. Leaf extracts as eco-conscious corrosion inhibitor for copper in H2SO4 medium10.1016/j.colsurfa.2025.136399 ↗
34. Insight into anti-corrosion mechanism of copper in 0.5 M sulfuric acid solution via microwave-assisted synthesis of carbon quantum dots as novel inhibitors
35. Some chemical aspects of the corrosion inhibition of copper by benztriazole10.1016/S0010-938X(79)80052-9 ↗
36. Theoretical and electrochemical analysis on inhibition effect of benzotriazole and 1,2,4-triazole on cobalt surface10.1016/j.colsurfa.2020.124516 ↗
37. Cu/barrier CMP on porous low-k based interconnect schemes10.1016/j.mee.2006.10.007 ↗
38. Electrochemical techniques and their applications for CMP of metal films10.1016/B978-0-12-821791-7.00009-5 ↗
39. Achievement of high planarization efficiency in CMP of copper at a reduced down pressure10.1016/j.mee.2008.11.047 ↗
40. Characterization of copper-hydrogen peroxide film growth kinetics10.1016/j.tsf.2006.02.010 ↗
41. A model of copper CMP10.1149/1.1861175 ↗
42. Characterization of 1, 2, 4-triazole as corrosion inhibitor for chemical mechanical polishing of cobalt in H2O2 based acid slurry10.1149/2.0131905jss ↗
43. Tribochemistry of abrasive machining10.1016/B978-081551490-9.50016-5 ↗
44. Lange · 1997 · 144
45. New insight in the behaviour of Co–H2O system at 25–150 °C, based on revised Pourbaix diagrams10.1016/j.corsci.2007.07.002 ↗
46. Cobalt polishing with reduced galvanic corrosion at copper/Cobalt interface using hydrogen peroxide as an oxidizer in colloidal silica-based slurries10.1149/2.073206jes ↗
47. Investigation of Cu-BTA complex formation during Cu chemical mechanical planarization process10.1016/j.apsusc.2016.05.106 ↗
48. A study of the electrochemical formation of Cu(I)-BTA films on copper electrodes and the mechanism of copper corrosion inhibition in aqueous chloride/benzotriazole solutions10.1016/0010-938X(94)90028-0 ↗
49. Adsorption on Cu(110), binding and geometry of the amino acid as a function of coverage10.1016/j.susc.2014.09.007 ↗
50. Three anionic surfactants for corrosion inhibition in cobalt CMP: research on validity and mechanism
51. Modeling the chemical-mechanical synergy during copper CMP10.1149/1.3526320 ↗
52. Material removal mechanism of copper CMP from a chemical–Mechanical synergy perspective10.1007/s11249-012-0037-2 ↗
53. Chandler, K.A. Marine and Offshore Corrosion: Marine Engineering Series; Elsevier, 2014.
54. Molecular modeling applied to corrosion inhibition: a critical review10.1038/s41529-024-00478-2 ↗
55. A concise review on corrosion inhibitors: types, mechanisms and electrochemical evaluation studies10.1007/s11998-021-00547-0 ↗
56. Experimental and numerical analysis of an inhibitor-containing slurry for copper chemical mechanical planarization10.1143/JJAP.44.82 ↗
57. Cu-CMP for dual damascene technology: prestonian vs. Non-Prestonian regimes of Cu removal10.1007/s11664-001-0050-y ↗
58. Electrical impedance measurements for detecting artificial chemical additives in liquid food products10.1016/j.foodcont.2016.01.044 ↗
59. Application of electrochemical impedance spectroscopy to commercial Li-ion cells: a review10.1016/j.jpowsour.2020.228742 ↗
60. Evaluation of corrosion inhibition of brass-118 in artificial seawater by benzotriazole using dynamic EIS10.1016/j.corsci.2009.06.040 ↗
61. The analysis of electrode impedances complicated by the presence of a constant phase element10.1016/S0022-0728(84)80324-1 ↗
62. A perspective on DRT applications for the analysis of solid oxide cell electrodes10.1016/j.electacta.2020.136328 ↗
63. Influence of the discretization methods on the distribution of relaxation times deconvolution: implementing radial basis functions with DRTtools10.1016/j.electacta.2015.09.097 ↗
64. The theory and design of plate glass polishing machines
65. A locally relevant prestonian model for wafer polishing10.1149/1.1532330 ↗
66. Ceria-based slurries for Non-Prestonian removal of silicon dioxide films10.1149/2.0091502jss ↗
67. Ab initio modeling of the bonding of benzotriazole corrosion inhibitor to reduced and oxidized copper surfaces10.1039/C4FD00257A ↗
68. DFT study on the adsorption of deprotonated benzotriazole on the defective copper surfaces10.1016/j.corsci.2021.109458 ↗
69. A novel method of etching copper oxide using acetic acid10.1149/1.1409400 ↗