Interaction between PCB-Cu corrosion and electrochemical migration under the Coupling of electric field and thin liquid film
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Corrosion Behavior and Inhibition · Electrodeposition and Electroless Coatings · Anodic Oxide Films and Nanostructures
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (33)
Show source-provided references
1. Effect of Ag on oxidation of Cu-base leadframe10.1016/j.microrel.2010.10.010 ↗
2. Surface failure analysis of a field-exposed copper-clad plate in a marine environment with industrial pollution10.1016/j.apsusc.2016.12.118 ↗
3. Evaluation of electrochemical migration on printed circuit boards with lead-free and Tin-lead solders
4. A review of corrosion and environmental effects on electronics
5. Study of DC and AC electromigration behavior in eutectic Pb-Sn solder joints10.1007/s11664-009-0852-x ↗
6. Improvement of electromigration lifetime of submicrometer dual-damascene Cu interconnects through surface engineering10.1149/1.2217267 ↗
7. Copper interconnects for semiconductor devices10.1007/s11837-001-0103-y ↗
8. The effects of Cl− ion concentration and relative humidity on atmospheric corrosion behavior of PCB-Cu under adsorbed thin electrolyte10.1016/j.corsci.2010.12.018 ↗
9. Experimental in situ studies of copper exposed to humidified air10.1016/S0010-938X(99)00125-0 ↗
10. Electrochemical migration behavior of copper-clad laminate and electroless nickel/immersion gold printed circuit boards under thin electrolyte layers10.3390/ma10020137 ↗
11. Combined effects of gaseous pollutants and sodium chloride particles on the atmospheric corrosion of copper10.5006/1.3280618 ↗
12. Atmospheric corrosion effects of HNO3—influence of temperature and relative humidity on laboratory-exposed copper10.1016/j.atmosenv.2006.10.018 ↗
13. Copper corrosion in hot and dry atmosphere environment in Turpan10.1016/S1003-6326(16)64281-4 ↗
14. Effects of direct current electric field on corrosion behaviour of copper, Cl− ion migration behaviour and dendrites growth under thin electrolyte layer10.1016/S1003-6326(14)63059-4 ↗
15. Effect of direct current electric field on atmospheric corrosion behavior of copper under thin electrolyte layer10.1016/j.corsci.2011.04.017 ↗
16. dependence of electrochemical migration of sintered nanosilver on chloride10.1016/j.matchemphys.2014.12.001 ↗
17. Printed circuit board surface finish and effects of chloride contamination, electric field, and humidity on corrosion reliability10.1007/s11664-016-4974-7 ↗
18. Effect of the direct current electric field on the initial corrosion of steel in simulated industrial atmospheric environment10.1016/j.corsci.2015.07.029 ↗
19. Characteristics of environmental factor for electrochemical migration on printed circuit board10.1007/s10854-007-9421-3 ↗
20. Electrochemistry on microcircuits. II: Copper dendrites in oxalic acid10.1016/j.mee.2007.12.054 ↗
21. The corrosion and oxidation of metals10.1149/1.2428098 ↗
22. Atmospheric corrosion /by christofer leygraf and thomas graedel
23. The influence of copper upon the atmospheric corrosion of iron10.1016/0010-938X(87)90058-8 ↗
24. Hydrogen ion reduction in the process of iron rusting10.1016/j.corsci.2004.07.044 ↗
25. Electrochemical migration failure mechanism and dendrite composition characteristics of Sn96.5Ag3.0Cu0.5 alloy in thin electrolyte films10.1007/s10854-019-00964-3 ↗
26. Electrochemical processes resulting in migrated short failures in microcircuits
27. Electrochemical migration of tin in thin electrolyte layer containing chloride ions10.1016/j.corsci.2013.04.015 ↗
28. The corrosion of tin under thin electrolyte layers containing chloride10.1016/j.corsci.2012.08.040 ↗
29. In situ study the dependence of electrochemical migration of tin on chloride10.1016/j.elecom.2012.11.010 ↗
30. On the electrochemical migration mechanism of tin in electronics10.1016/j.corsci.2011.06.015 ↗
31. Analysis of the kinetics of electrochemical migration on printed circuit boards using nernst-planck transport equation10.1016/j.electacta.2014.06.041 ↗
32. The evolution of outdoor copper patina10.1016/S0010-938X(01)00081-6 ↗
33. In situ study the electrochemical migration of tin under unipolar square wave electric field10.1149/2.014311jes ↗