Development of a CNT/Bi2S3/PVDF composite waterproof film-based strain sensor for motion monitoringl
Source abstract
Abstract
An innovative flexible electronic device was developed by integrating functionalized carbon nanotubes, bismuth sulfide nanostructures, and a polyvinylidene fluoride matrix to create a highly water‐resistant strain detection platform. The fabricated film exhibited a remarkable static water contact angle of 141°, with only a 3–4° reduction after 48 hours of immersion, confirming its excellent hydrophobic performance. Mechanical testing revealed a tensile strength of 43.2 MPa and maintained over 96% of its original strength following 1000 bending cycles, thereby demonstrating outstanding durability under repetitive deformation. Electrical characterization showed an initial conductivity of 12.3 S/m and a baseline resistance near 98 Ω, with less than a 5% change observed during cyclic loading. Furthermore, the device achieved a gauge factor of 76 within the linear strain region up to 60%, indicating high sensitivity to applied stress. Dynamic performance assessments recorded rapid response and recovery times of 0.12 and 0.15 seconds, respectively, enabling real-time monitoring of mechanical variations. In practical demonstrations, the sensor delivered distinct resistance increments of 35% during full finger flexion and 28% during wrist movements. Long-term evaluations conducted over 60 days under fluctuating temperature (15 °C to 35 °C) and humidity conditions (40% to 90% RH) showed a normalized response variation of less than 3%. These quantitative results confirm that the proposed device offers a balanced combination of mechanical robustness, electrical stability, and rapid responsiveness, making it a promising candidate for next-generation wearable electronics and health monitoring applications. These findings lay a robust foundation for further exploration and optimization in advanced flexible devices.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Conducting polymers and applications · Dielectric materials and actuators
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (34)
Show source-provided references
1. [1] L. Gao, G. Zhang, B. Yu, Z. Qiao, J. Wang, Measurement 166, 108252 (2020);10.1016/j.measurement.2020.108252 ↗
2. [ https://doi.org/10.1016/j.measurement.2020.10825210.1016/j.measurement.2020.108252 ↗
3. [2] M. Lin, Z. Zheng, L. Yang, M. Luo, L. Fu, B. Lin, C. Xu, Advanced Materials 34, 2107309 (2022); https://doi.org/10.1002/adma.20210730910.1002/adma.202107309 ↗
4. [3] O. Ergen, E. Celik, A. H. Unal, M. Y. Erdolu, F. E. Sarac, U. Unal, Lab on a Chip 20, 2689 (2020); https://doi.org/10.1039/D0LC00545B10.1039/D0LC00545B ↗
5. [4] T. Nakamura, K. Kiyono, H. Wendt, P. Abry, Y. Yamamoto, Proceedings of the IEEE 104, 242 (2016); https://doi.org/10.1109/JPROC.2015.249197910.1109/JPROC.2015.2491979 ↗
6. [5] H. Liu, H. Zhang, W. Han, H. Lin, R. Li, J. Zhu, W. Huang, Advanced Materials 33, 2004782 (2021); https://doi.org/10.1002/adma.20200478210.1002/adma.202004782 ↗
7. [6] J. Heikenfeld, A. Jajack, J. Rogers, P. Gutruf, L. Tian, T. Pan, R. Li, M. Khine, J. Kim, J. Wang, J. Kim, Lab on a Chip 18, 217 (2018); https://doi.org/10.1039/C7LC00914C10.1039/C7LC00914C ↗
8. [7] M. Xie, K. Hisano, M. Zhu, T. Toyoshi, M. Pan, S. Okada, O. Tsutsumi, S. Kawamura, C. Bowen, Advanced Materials Technologies 4, 1800626 (2019); https://doi.org/10.1002/admt.20180062610.1002/admt.201800626 ↗
9. [8] R. E. Roy, R. S. Rajeev, Polymers for Advanced Technologies 35, e6262 (2024).10.1002/pat.6262 ↗
10. [9] X. Qi, H. Lv, Y. Wang, Y. Ye, P. Wang, A. Yin, J. Luo, Z. Ren, H. Liu, J. Liu, S. Yu, J. Wei, ChemNanoMat 10, e202400264 (2024).10.1002/cnma.202400264 ↗
11. [10] X. Fang, Z. Jia, Y. Yang, R. Li, H. Huang, Q. Lin, Applied Physics Letters 122, 192102 (2023); https://doi.org/10.1063/5.015017510.1063/5.0150175 ↗
12. [11] G. Kang, Y. Cao, Journal of Membrane Science 463, 145 (2014); https://doi.org/10.1016/j.memsci.2014.03.05510.1016/j.memsci.2014.03.055 ↗
13. [12] V. Díaz Mena, X. X. F. S. Romate, D. M. Díaz, M. S. Martínez, A. U. Fernández, IEEE Sensors Journal 24, 16902 (2024); https://doi.org/10.1109/JSEN.2024.338155010.1109/JSEN.2024.3381550 ↗
14. [13] M. Saadat-Safa, V. Nayyeri, M. Khanjarian, M. Soleimani, O. M. Ramahi, IEEE Transactions on Microwave Theory and Techniques 67, 806 (2019); https://doi.org/10.1109/TMTT.2018.288282610.1109/TMTT.2018.2882826 ↗
15. [14] Q. Chen, S. Y. Ma, X. L. Xu, H. Y. Jiao, G. H. Zhang, L. W. Liu, P. Y. Wang, D. J. Gengzang, H. H. Yao, Sensors and Actuators, B: Chemical 264, 263 (2018); https://doi.org/10.1016/j.snb.2018.02.17210.1016/j.snb.2018.02.172 ↗
16. [15] S. Barrau, A. Ferri, A. Da Costa, J. Defebvin, S. Leroy, R. Desfeux, J.-M. Lefebvre, ACS Applied Materials & Interfaces 10, 13092 (2018); https://doi.org/10.1021/acsami.8b0217210.1021/acsami.8b02172 ↗
17. [16] J. Ma, X. Nan, J. Liu, Polymers for Advanced Technologies 28, 166 (2017); https://doi.org/10.1002/pat.387110.1002/pat.3871 ↗
18. [17] P. B. Souza, M. A. Tumelero, R. Faccio, R. Ahmed, C. C. Plá Cid, G. Zangari, A. A. Pasa, 663 Physical Chemistry Chemical Physics 25, 14440 (2023); https://doi.org/10.1039/D2CP04945G10.1039/D2CP04945G ↗
19. [18] X. Guo, C. Li, C. Li, T. Wei, L. Tong, H. Shao, Q. Zhou, L. Wang, Y. Liao, Frontiers of Environmental Science & Engineering 13, 81 (2019); https://doi.org/10.1007/s11783-019-1165-910.1007/s11783-019-1165-9 ↗
20. [19] S. Merugu, L. T. Kearney, J. K. Keum, A. K. Naskar, J. Ansary, A. Herbert, M. Islam, K. Mondal, A. Gupta, ACS Omega 9, 28764 (2024); https://doi.org/10.1021/acsomega.4c0302410.1021/acsomega.4c03024 ↗
21. [20] H. Qian, M. Zhu, H. Song, H. Wang, Z. Liu, C. Wang, Progress in Organic Coatings 142, 105566 (2020); https://doi.org/10.1016/j.porgcoat.2020.10556610.1016/j.porgcoat.2020.105566 ↗
22. [21] Y. Wang, M. Han, L. Liu, J. Yao, L. Han, ACS Applied Materials & Interfaces 12, 20942 (2020); https://doi.org/10.1021/acsami.0c0357710.1021/acsami.0c03577 ↗
23. [22] W. Zhou, Y. Yu, S. Bai, A. Hu, Optics & Laser Technology 135, 106694 (2021); https://doi.org/10.1016/j.optlastec.2020.10669410.1016/j.optlastec.2020.106694 ↗
24. [23] C. C. Vu, J. Kim, Science and Technology of Advanced Materials 22, 718 (2021); https://doi.org/10.1080/14686996.2021.196110010.1080/14686996.2021.1961100 ↗
25. [24] M. Kim, H. Choi, T. Kim, I. Hong, Y. Roh, J. Park, S. Seo, S. Han, J. Koh, D. Kang, Materials 12, 1516 (2019); https://doi.org/10.3390/ma1209151610.3390/ma12091516 ↗
26. [25] G. J. Wang, Y. P. Cai, Y. J. Ma, Z. H. Cao, X. K. Meng, Composites Part A: Applied Science and Manufacturing 121, 189 (2019); https://doi.org/10.1016/j.compositesa.2019.03.03210.1016/j.compositesa.2019.03.032 ↗
27. [26] P. Rusinov, Z. Blednova, A. Rusinova, G. Kurapov, M. Semadeni, Metals 13, 1177 (2023); https://doi.org/10.3390/met1307117710.3390/met13071177 ↗
28. [27] J. Shintake, Y. Piskarev, S. H. Jeong, D. Floreano, Advanced Materials Technologies 3, 1700284 (2018); https://doi.org/10.1002/admt.20170028410.1002/admt.201700284 ↗
29. [28] X. Fu, M. Ramos, A. M. Al-Jumaily, A. Meshkinzar, X. Huang, Journal of Materials Science 54, 2170 (2019); https://doi.org/10.1007/s10853-018-2954-410.1007/s10853-018-2954-4 ↗
30. [29] J. You, J. Zhang, J. Zhang, Z. Yang, X. Zhang, ACS Applied Materials & Interfaces 14, 55812 (2022); https://doi.org/10.1021/acsami.2c1813510.1021/acsami.2c18135 ↗
31. [30] S. Han, A. Chand, S. Araby, R. Cai, S. Chen, H. Kang, R. Cheng, Q. Meng, Nanotechnology 31, 75702 (2020); https://doi.org/10.1088/1361-6528/ab504210.1088/1361-6528/ab5042 ↗
32. [31] L. Wang, F. Zhang, W. Su, X. Xu, A. Li, Y. Li, C. Xu, Y. Sun, ACS Applied Materials & Interfaces 14, 26024 (2022); https://doi.org/10.1021/acsami.2c0429610.1021/acsami.2c04296 ↗
33. [32] T. E. Glier, M. Betker, M. Witte, T. Matsuyama, L. Westphal, B. Grimm-Lebsanft, F. Biebl, L. O. Akinsinde, F. Fischer, M. Rübhausen, Nanoscale 12, 23831 (2020); https://doi.org/10.1039/D0NR05734G10.1039/D0NR05734G ↗
34. [33] G.-H. Feng, C.-T. Yeh, in 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) (IEEE, 2024), pp. 1-4.10.1109/FLEPS61194.2024.10603687 ↗