journal article·2018-02-27

Defect-Free Graphene Synthesized Directly at 150 °C via Chemical Vapor Deposition with No Transfer

Byeong-Ju Park, Jin-Seok Choi, Ji-Ho Eom, Hyunwoo Ha, Hyun You Kim, Seonhee Lee, Hyunjung Shin, Soon-Gil Yoon

ACS Nano· Volume 12· Issue 2
Publisher page

Abstract

Direct graphene synthesis on substrates via chemical vapor deposition (CVD) is an attractive approach for manufacturing flexible electronic devices. The temperature for graphene synthesis must be below ∼200 °C to prevent substrate deformation while fabricating flexible devices on plastic substrates. Herein, we report a process whereby defect-free graphene is directly synthesized on a variety of substrates via the introduction of an ultrathin Ti catalytic layer, due to the strong affinity of Ti to carbon. Ti with a thickness of 10 nm was naturally oxidized by exposure to air before and after the graphene synthesis, and the various functions of neither the substrates nor the graphene were influenced. This report offers experimental evidence of high-quality graphene synthesis on Ti-coated substrates at 150 °C via CVD. The proposed methodology was applied to the fabrication of flexible and transparent thin-film capacitors with top electrodes of high-quality graphene.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Graphene research and applications · Advancements in Battery Materials · Supercapacitor Materials and Fabrication

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Materials Science and Engineering, Chungnam National University, Daeduk Science Town, 34134 Daejeon, South Korea

Analysis Center for Research Advancement (KARA), Korea Advanced Institute of Science and Technology, 291 Daehak-ro, Yuseong-gu, 34141 Daejeon, South Korea

Department of Energy Science, Sungkyunkwan University, 300 CheonCheon-dong, Jangan-gu, 16419 Suwon, Gyeonggi-do, South Korea

Funding

National Research Foundation of Korea

References (37)

Show source-provided references
1. 10.1021/ja109793s10.1021/ja109793s ↗
2. 10.1021/nn103102a10.1021/nn103102a ↗
3. 10.1039/c1cp22347j10.1039/c1cp22347j ↗
4. 10.1038/ncomms165010.1038/ncomms1650 ↗
5. 10.1063/1.491411410.1063/1.4914114 ↗
6. 10.1126/science.125226810.1126/science.1252268 ↗
7. 10.1038/srep1795510.1038/srep17955 ↗
8. 10.1038/s41598-017-12380-w10.1038/s41598-017-12380-w ↗
9. 10.1039/c3ce27029g10.1039/c3ce27029g ↗
10. 10.1039/C1JM14778A10.1039/C1JM14778A ↗
11. 10.1021/nn100971s10.1021/nn100971s ↗
12. 10.1038/srep1183910.1038/srep11839 ↗
13. 10.1002/1521-4095(20021104)14:21<1560::AID-ADMA1560>3.0.CO;2-P10.1002/1521-4095(20021104)14:21<1560::AID-ADMA1560>3.0.CO;2-P ↗
14. 10.1038/srep0961010.1038/srep09610 ↗
15. 10.1039/c3ce27029g10.1039/c3ce27029g ↗
16. 10.1186/1556-276X-8-28510.1186/1556-276X-8-285 ↗
17. 10.1063/1.338781210.1063/1.3387812 ↗
18. 10.1126/science.115696510.1126/science.1156965 ↗
19. 10.1016/S0022-3093(99)00904-710.1016/S0022-3093(99)00904-7 ↗
20. 10.1163/156939396X0114310.1163/156939396X01143 ↗
21. 10.1002/adma.20080015010.1002/adma.200800150 ↗
22. 10.1063/1.321273510.1063/1.3212735 ↗
23. Borland, W. J.; Ferguson, S.Embedded Passive Components in Printed Wiring Boards: A Technology Review.CircuiTree Magazine 2011, March, 94–106.
24. 10.1088/1361-6528/aa55e610.1088/1361-6528/aa55e6 ↗
25. 10.1039/c2ra20463k10.1039/c2ra20463k ↗
26. 10.1063/1.240289610.1063/1.2402896 ↗
27. 10.1063/1.243533610.1063/1.2435336 ↗
28. 10.1063/1.277138110.1063/1.2771381 ↗
29. 10.1063/1.301336210.1063/1.3013362 ↗
30. 10.1021/nn901587x10.1021/nn901587x ↗
31. Zhang W. · Mater. Forum · 2007 · 31 · 76
32. 10.1023/A:101537893111110.1023/A:1015378931111 ↗
33. 10.1021/j100124a04810.1021/j100124a048 ↗
34. 10.1557/jmr.2009.028610.1557/jmr.2009.0286 ↗
35. 10.1103/PhysRevB.54.1116910.1103/PhysRevB.54.11169 ↗
36. 10.1103/PhysRevLett.77.386510.1103/PhysRevLett.77.3865 ↗
37. 10.1103/PhysRevB.50.1795310.1103/PhysRevB.50.17953 ↗