journal article·2007-08

Ion beam modification of ceramic component prior to formation of AlN-Cu joints by direct bonding process

M. Barlak, W. Olesinska, J. Piekoszewski, Z. Werner, M. Chmielewski, J. Jagielski, D. Kalinski, B. Sartowska, K. Borkowska

Surface and Coatings Technology· Volume 201· Issue 19-20
Publisher page

Abstract

Abstract Ion implantation was utilized as a pre-treatment method for direct bonding of ceramics with copper. Aluminum nitride samples were implanted with metallic ions (Ti, Cr, Fe, Cu) and/or with oxygen. The choice of implanted species was based upon thermodynamic considerations. Direct bonding was performed by a conventional method of furnace annealing in nitrogen atmosphere. Shear strength measurements of the joints were used as a method of joint quality verification. The samples were additionally characterized by RBS measurements and the shear fracture surface was analyzed by optical microscopy. It has been concluded that the joints formed on ion implantation pre-treated aluminum nitride exhibit superior quality with respect to conventionally treated (oxidized) material. It has also been found that the optimum properties are exhibited by material in which thin titanium nitride surface layer is formed by low-fluence Ti implantation and that the presence of oxygen has a detrimental effect upon the joint quality, although oxygen implantation is potentially a promising approach.
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Research context

OpenAlex topics: Advanced ceramic materials synthesis · Metal and Thin Film Mechanics · Semiconductor materials and devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (9)

Show source-provided references
1. Entezarian · Mater. Sci. Eng. · 1996 · A212 · 20610.1016/0921-5093(96)10190-8 ↗
2. Joyeux · Eng. Mater. · 2002 · 206–213 · 555
3. Kubaschewski · 1979 · vol. 24 · 267
4. Joyeux · Eng. Mater. · 2002 · 206–213 · 535
5. Piekoszewski · Solid State Phenom. · 2004 · 99–100 · 23110.4028/www.scientific.net/SSP.99-100.231 ↗
6. Tillmann · J. Mater. Sci. · 1996 · 31 · 44510.1007/BF01139163 ↗
7. M.G. Nicholas, Material Science and Technology, Processing of ceramics Vol. 17B, Part II, VCH Verlagsgesellschaft mbH, Weinheim, VCH Publishers Inc., New York, Basel, Cambridge, Tokyo: Weinheim, 1st 1996, p. 261 in: Cahn RW, Haasen P, Kramer EJ, editors.
8. S. Bugaev, A. Nikolaev, P. Oks, E. Schanin, G. Yushkov, Rev. Sci. Instrum. 1994; 10:3110. Nicholas MG. Joining of Ceramic, Chapman and Hall London, 1990.
9. Barlak · Vacuum · 2005 · 78 · 20510.1016/j.vacuum.2005.01.027 ↗