journal article·2025-10-28Open access

Thermally Activated Negative Differential Resistance VO x Memristor with Switchable Rate and Leaky Integrate-and-Fire Spiking Dynamics

Li-Chung Shih, Zih-Siao Liao, Gennady Cherkashinin, Eszter Piros, Lambert Alff, Jen-Sue Chen

ACS Nano· Volume 19· Issue 42

Abstract

High Resolution Image Download MS PowerPoint Slide Spiking neural networks (SNNs) require neuron devices that are both compact and capable of supporting continuous-time and event-based dynamics. Here, we demonstrate a VO x -based threshold switching memristor (TSM) that intrinsically enables dual-mode operation, functioning as both a spiking encoder and a leaky integrate-and-fire (LIF) neuron. While such dual behavior is theoretically possible in volatile memristors, it has only been experimentally demonstrated in limited cases. It is achieved intrinsically in a single VO x -based device, arising from a thermally driven insulator-to-metal transition (IMT) within the VO x layer, confirmed by temperature-dependent XRD and correlated with snap-back negative differential resistance (NDR) observed in electrical measurements. Integrated into a passive circuit, the device generates high-frequency spike trains under analog input and tunable LIF responses under pulsed stimulation. The device achieves a maximum spiking frequency of 570 kHz, a time-to-first-spike (TTFS) of 1.6 μs, and energy consumption as low as 4.7 nJ per spike. These results highlight the strong coupling between structural phase dynamics and neuronal functions, positioning the VO x TSM as a promising platform for scalable neuromorphic hardware with biologically realistic spiking capabilities.
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Research context

OpenAlex topics: Advanced Memory and Neural Computing · Photoreceptor and optogenetics research · Transition Metal Oxide Nanomaterials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Materials Science and Engineering

National Cheng Kung University

Advanced Thin Film Technology Division, Institute of Materials Science, Technische Universität Darmstadt, Peter-Grünberg-Str. 2, Darmstadt 64287, Germany

Program on Semiconductor Packaging and Testing, Academy of Innovative Semiconductor and Sustainable Manufacturing

Funding

Bundesministerium f?r Bildung und Forschung · Deutsche Forschungsgemeinschaft · Electronic Components and Systems for European Leadership · National Science and Technology Council

References (53)

Show source-provided references
1. 10.1016/S0893-6080(97)00011-710.1016/S0893-6080(97)00011-7 ↗
2. 10.1016/j.neunet.2018.12.00210.1016/j.neunet.2018.12.002 ↗
3. 10.1038/s41586-019-1677-210.1038/s41586-019-1677-2 ↗
4. 10.1126/scirobotics.abl734410.1126/scirobotics.abl7344 ↗
5. 10.1038/s41928-020-0435-710.1038/s41928-020-0435-7 ↗
6. 10.1021/acsnano.4c1288410.1021/acsnano.4c12884 ↗
7. 10.1038/s41467-024-48103-910.1038/s41467-024-48103-9 ↗
8. 10.1021/acs.chemrev.3c0052710.1021/acs.chemrev.3c00527 ↗
9. 10.1002/adfm.20220410210.1002/adfm.202204102 ↗
10. 10.3389/fnins.2015.0037610.3389/fnins.2015.00376 ↗
11. 10.1038/s41598-019-47348-510.1038/s41598-019-47348-5 ↗
12. 10.1038/s44172-024-00165-910.1038/s44172-024-00165-9 ↗
13. 10.1002/adfm.20160474010.1002/adfm.201604740 ↗
14. 10.1103/PhysRevApplied.23.03403010.1103/PhysRevApplied.23.034030 ↗
15. 10.1002/aelm.20230046710.1002/aelm.202300467 ↗
16. 10.1038/s41928-018-0023-210.1038/s41928-018-0023-2 ↗
17. 10.1002/adma.20230286310.1002/adma.202302863 ↗
18. 10.1109/LED.2019.293626110.1109/LED.2019.2936261 ↗
19. 10.1002/aelm.20200030910.1002/aelm.202000309 ↗
20. 10.1021/acsami.3c1862510.1021/acsami.3c18625 ↗
21. 10.1109/LED.2023.325900010.1109/LED.2023.3259000 ↗
22. 10.1109/TED.2022.323123310.1109/TED.2022.3231233 ↗
23. 10.1038/s41467-023-39430-410.1038/s41467-023-39430-4 ↗
24. 10.1038/s41467-024-51609-x10.1038/s41467-024-51609-x ↗
25. 10.1038/s41467-018-07052-w10.1038/s41467-018-07052-w ↗
26. 10.1002/aisy.20220007610.1002/aisy.202200076 ↗
27. Gerstner W. · 201410.1017/CBO9781107447615 ↗
28. 10.1109/TED.2022.321232510.1109/TED.2022.3212325 ↗
29. 10.1038/s41467-020-17215-310.1038/s41467-020-17215-3 ↗
30. 10.1038/ncomms947510.1038/ncomms9475 ↗
31. 10.1103/PhysRevLett.97.25680310.1103/PhysRevLett.97.256803 ↗
32. 10.1016/j.elspec.2004.03.00410.1016/j.elspec.2004.03.004 ↗
33. 10.1103/PhysRevLett.72.338910.1103/PhysRevLett.72.3389 ↗
34. 10.1103/PhysRevLett.95.19640410.1103/PhysRevLett.95.196404 ↗
35. 10.1103/PhysRevLett.94.02640410.1103/PhysRevLett.94.026404 ↗
36. 10.1038/s41467-020-17351-w10.1038/s41467-020-17351-w ↗
37. 10.1021/acs.chemrev.2c0054610.1021/acs.chemrev.2c00546 ↗
38. 10.1038/nphys273310.1038/nphys2733 ↗
39. 10.1002/adma.20140240410.1002/adma.201402404 ↗
40. 10.1038/nature2330710.1038/nature23307 ↗
41. 10.1002/adfm.20190506010.1002/adfm.201905060 ↗
42. 10.1063/5.002787510.1063/5.0027875 ↗
43. 10.1002/adma.20130204610.1002/adma.201302046 ↗
44. 10.1063/1.481772710.1063/1.4817727 ↗
45. 10.1038/s41586-019-1159-610.1038/s41586-019-1159-6 ↗
46. 10.1021/acsnano.4c1469610.1021/acsnano.4c14696 ↗
47. 10.1002/adma.20220262210.1002/adma.202202622 ↗
48. 10.1038/nrn262110.1038/nrn2621 ↗
49. 10.1021/acs.chemrev.4c0004910.1021/acs.chemrev.4c00049 ↗
50. 10.3389/fnins.2018.0077410.3389/fnins.2018.00774 ↗
51. 10.1109/TNN.2003.82044010.1109/TNN.2003.820440 ↗
52. 10.1002/adma.20180384910.1002/adma.201803849 ↗
53. 10.1038/s41467-019-13827-610.1038/s41467-019-13827-6 ↗