Hierarchically Biporous Wick Vapor Chamber With Micro/Nano Condenser for Exceeding 600 W/cm ² Heat Dissipation

ABSTRACT The rapid advancement of high‐power electronic devices has created an urgent need for more effective thermal management solutions, as inadequate heat dissipation severely limits device performance and reliability. Conventional vapor chambers could dissipate heat efficiently via liquid‐vapor phase change heat transfer but are limited due to capillary pressure‐permeability trade‐off and the long, tortuous condensate return path, resulting in insufficient liquid supply under high thermal loads and making them unsuitable for next‐generation high‐power electronics. Herein, we developed a vapor chamber for high heat flux dissipation by incorporating a hierarchically biporous superhydrophilic evaporator wick for enhanced capillary‐driven liquid supply, along with a superhydrophobic micro/nano‐structured condenser surface that enables dropwise condensation and facilitates condensate return. This synergistic design ensures a continuous and efficient liquid supply, achieving a minimum overall thermal resistance of ∼0.17°C/W, a minimum thermal resistance of temperature uniformity of ∼0.02°C/W, and a critical heat dissipation flux exceeding 600 W/cm ^2— even under gravity‐opposed conditions—showing significant enhancement compared to previous vapor chamber designs. This work provides a promising solution for next‐generation high‐power electronics requiring extreme heat flux dissipation.