High‐Performance Flexible Electronics Fabricated Using a Surface Energy‐Directed Assembly Process on Ultrathin Polyimide Substrates (Small 29/2025)
Source abstract
Abstract
Flexible Electronics In article number 2409458, Zhimin Chai, Xinchun Lu, and co-workers report on constructing hydrophilic and hydrophobic patterned surfaces on polyimide (PI) substrates, addressing the problem that PI substrates are difficult to process into sufficiently hydrophobic. With the proposed pretreatment, a threefold improvement in active sites is achieved to ensure that PI could react adequately with the hydrophobic molecules. The pretreatment enables fabrication of all-solution-processed metal oxide electronics on PI substrates.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Materials and Mechanics · Advanced Sensor and Energy Harvesting Materials · Additive Manufacturing and 3D Printing Technologies
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Affiliations
Department of Mechanical Engineering Tsinghua University Beijing 100084 China
State Key Laboratory of Tribology in Advanced Equipment Tsinghua University Beijing 100084 China
NSF Nanoscale Science and Engineering Center for High‐Rate Nanomanufacturing (CHN) Northeastern University Boston MA 02115 USA
References
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