3D Microsupercapacitors: 3D Interdigitated Microsupercapacitors with Record Areal Cell Capacitance (Small 27/2019)
Source abstract
Abstract
Microscale energy storage for embedded electronics remains a major challenge at the dawn of the Internet of Things. In article number 1901224, David Pech, Daniel Guay, and co-workers describe the integration of 3D pseudocapacitive electrodes on a silicon wafer to realize all-solid-state interdigitated microsupercapacitors with a record cell capacitance of 812 mF cm−2 per footprint area.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Supercapacitor Materials and Fabrication
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Affiliations
LAAS‐CNRS, Université de Toulouse, CNRS 31400 Toulouse France
INRS‐Énergie, Matériaux et Télécommunications 1650 Boulevard Lionel Boulet Varennes Québec J3X 1S2 Canada
PRIMA Québec 505 Boulevard Maisonneuve Ouest Montréal Québec H3A 3C2 Canada
References
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