On‐Chip: Direct Microrolling Processing on a Silicon Wafer (Small 36/2017)
Source abstract
Abstract
In article number 1701630, Kanna Aoki and co-workers achieve patterning of porosified silicon wafer surfaces using anodic oxidation, and conventional photolithography and wet etching. Subsequent oxidation treatment facilitated self-rolling in the porous silicon layers. Various three-dimensional shapes such as bowls, tubes, and boxes were realized. A direct silicon-processing technology that enables thin layers of silicon surfaces to be bent into various three-dimensional curved structures at the micron scale is useful for expanding the capabilities and design possibilities of on-chip Si devices.
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Research context
OpenAlex topics: Modular Robots and Swarm Intelligence
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Affiliations
Department of Electrical and Electronic Engineering Graduate School of Engineering Kobe University 1‐1 Rokkodai, Nada Kobe Hyogo 657‐8501 Japan
Frontier Research Laboratory National Institute of Information and Communications Technology 4‐2‐1 Nukui‐Kitamachi Koganei Tokyo 184‐8795 Japan
World Premier International Research Center‐Advanced Institute for Materials Research (WPI‐AIMR) Tohoku University 2‐1‐1 Katahira Aoba‐ku Sendai 980‐8577 Japan
References
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