Graphene: Metal-Etching-Free Direct Delamination and Transfer of Single-Layer Graphene with a High Degree of Freedom (Small 2/2015)

A novel transfer process with an elastomeric stamp is described on page 175 by S.-Y. Choi and co-workers. It includes the metal-etching free, direct delamination of graphene from a copper growth substrate and transfer to a flexible substrate. The capabilities of the developed transfer process, such as large-area transfer onto a flexible substrate, multi-layer stacking of graphene, and transfer onto a structured electrode surface are demonstrated.