Foams: Configurable Three‐Dimensional Boron Nitride–Carbon Architecture and Its Tunable Electronic Behavior with Stable Thermal Performances (Small 15/2014)

2D materials (e.g., graphene, h-boron nitride) can be scaled up into freestanding ultralight 3D-foam-like structures for enhancing surface area and mechanical properties. In order to broaden their application field, on page 2992, E. H. T. Teo and colleagues demonstrate the first synthesis of a novel 3D boron-nitride-carbon foam with high and stable thermal conductivity while offering highly tunable electrical and controllable EMI shielding properties. With this, new customizable applications such as electronic packaging and top based thermal interface materials are now possible.