Directed Fracture for the Fabrication of Free‐Standing Multilayered Submicrometer Structures

Microdevices are fractured at specific sites to fabricate free-standing multilayered submicrometer structures, which consist of the microdevice cross sections that become exposed after fracture. As determined by finite-element modeling, the microdevices feature a fracturing point where stress concentrates under applied pulling forces. The structures fabricated here have a core of phosphosilicate glass surrounded by a layer of polycrystalline silicon. Detailed facts of importance to specialist readers are published as ”Supporting Information”. Such documents are peer-reviewed, but not copy-edited or typeset. They are made available as submitted by the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.