Universal Magnetic‐Conductive Interfaces Enabling Reversible Interconnections in Fiber Electronics

Abstract Fiber electronics have gained significant attention for their seamless integration into textiles, offering enhanced flexibility, breathability, and wearability. However, conventional circuit assembly methods for fiber devices often rely on rigid and irreversible connections, such as silver conductive adhesives, which impede essential modifications in electronic textiles like energy module upgrades, sensor replacements, and damage repair. Here, a universal magnetic‐conductive (MC) interface that facilitates robust, reversible interconnections for fiber electronics is presented. Fabricated by sequentially depositing a magnetic interlayer and a conductive sheath on electrode ends using a coating die, this interface is compatible with diverse fiber devices. Upon close proximity, the MC interfaces magnetically attract and establish a stable electrical pathway spontaneously (<40 ms), delivering conductivity comparable to cured silver paste. Remarkably, the connection retains its performance over 10 000 connect‐disconnect cycles, mechanical swinging cycles, and operations under diverse environmental conditions. The versatility of the MC interface is further demonstrated by creating a detachable fabric power bank to power wearable devices and integrating a removable signal‐processing textile for on‐demand electrocardiogram monitoring in rats. Overall, this innovation establishes a universal, scalable platform for the assembly of fiber electronics, paving the way for next‐generation customizable wearable devices.