Biomimetic Microstructure with Anti‐Slip and Anti‐Adhesion for Efficient Handling of Brittle Material Surfaces in High‐Temperature Environments
Source abstract
Abstract
Abstract Non‐destructive handling such as wafer handling usually requires a high‐temperature environment, however, most bionic materials fail in high temperatures due to material decomposition. In this study, inspired by the unique microstructure of locust toe pads with low adhesion and high friction, bionic high‐temperature friction pads are designed and fabricated, selecting high‐temperature‐resistant silicone rubber as the material. The interfacial mechanical properties at high temperatures are analyzed. The samples with terminal bulges possess preferable roughness adaptability, enabling the advantages of low adhesion and high friction in high temperatures. The high‐temperature non‐destructive handling experiment using a robotic arm verifies the feasibility of bionic high‐temperature friction pads in industrial applications and provides a valuable solution for non‐destructive handling in high‐temperature environments.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Adhesion, Friction, and Surface Interactions · Advanced Sensor and Energy Harvesting Materials · Polymer Surface Interaction Studies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Jiangsu Key Laboratory of Bionic Materials and Equipment College of Mechanical and Electrical Engineering Nanjing University of Aeronautics and Astronautics No. 29 Yudao Street Nanjing 210016 China
Department of Product and Technology Development Nanjing Adhesion Technology Co., LTD. No. 288 Qinhuai Avenue Nanjing 211200 China
Funding
National Natural Science Foundation of China
References (31)
Show source-provided references
1. 10.1016/j.jmsy.2020.12.00610.1016/j.jmsy.2020.12.006 ↗
2. 10.1039/D0TA04977H10.1039/D0TA04977H ↗
3. 10.1038/s42254-021-00283-910.1038/s42254-021-00283-9 ↗
4. 10.1002/aisy.20210003410.1002/aisy.202100034 ↗
5. 10.1109/TIA.2002.100343810.1109/TIA.2002.1003438 ↗
6. 10.1016/j.rcim.2010.06.02110.1016/j.rcim.2010.06.021 ↗
7. 10.1038/s41551-021-00732-x10.1038/s41551-021-00732-x ↗
8. 10.1016/j.bios.2022.11488210.1016/j.bios.2022.114882 ↗
9. 10.1021/acsami.7b0197910.1021/acsami.7b01979 ↗
10. 10.1016/j.matdes.2022.11076510.1016/j.matdes.2022.110765 ↗
11. Liu R. · ACS Appl. Mater. Interfaces · 2024 · 16
12. 10.1073/pnas.050632810210.1073/pnas.0506328102 ↗
13. 10.1038/ncomms257610.1038/ncomms2576 ↗
14. 10.1098/rsif.2016.037110.1098/rsif.2016.0371 ↗
15. 10.1002/smll.20240185910.1002/smll.202401859 ↗
16. 10.1002/admt.20230138710.1002/admt.202301387 ↗
17. 10.1002/smll.20200549310.1002/smll.202005493 ↗
18. 10.1016/j.pmatsci.2021.10082310.1016/j.pmatsci.2021.100823 ↗
19. 10.1016/j.triboint.2023.10917810.1016/j.triboint.2023.109178 ↗
20. 10.1098/rspb.2000.113310.1098/rspb.2000.1133 ↗
21. 10.1007/s00359-006-0156-z10.1007/s00359-006-0156-z ↗
22. 10.1002/adfm.20180086510.1002/adfm.201800865 ↗
23. 10.1021/acs.langmuir.9b0019210.1021/acs.langmuir.9b00192 ↗
24. Jagota A. · Mater. Sci. Eng.: R: Rep. · 2011 · 72 · 253
25. 10.1007/3-540-45141-2_210.1007/3-540-45141-2_2 ↗
26. 10.1098/rsif.2005.007010.1098/rsif.2005.0070 ↗
27. 10.1016/0021-9797(92)90285-T10.1016/0021-9797(92)90285-T ↗
28. 10.1039/c0sm01482f10.1039/c0sm01482f ↗
29. Johnson K. L. · Proc. R. Soc. A · 1558 · 324 · 301
30. 10.1016/j.triboint.2022.10753410.1016/j.triboint.2022.107534 ↗
31. 10.1126/science.107237810.1126/science.1072378 ↗