journal article·2022-09

High Power Figure‐of‐Merit, 10.6‐kV AlGaN/GaN Lateral Schottky Barrier Diode with Single Channel and Sub‐100‐µm Anode‐to‐Cathode Spacing

Ru Xu, Peng Chen, Jing Zhou, Yimeng Li, Yuyin Li, Tinggang Zhu, Kai Cheng, Dunjun Chen, Zili Xie, Jiandong Ye, Bin Liu, Xiangqian Xiu, Ping Han, Yi Shi, Rong Zhang, Youdou Zheng

Small· Volume 18· Issue 37
Publisher page

Abstract

Abstract GaN‐based lateral Schottky barrier diodes (SBDs) have attracted great attention for high‐power applications due to its combined high electron mobility and large critical breakdown field. However, the breakdown voltage (BV) of the SBDs are far from exploiting the material advantages of GaN at present, limiting the desire to use GaN for ultra‐high voltage (UHV) applications. Then, a golden question is whether the excellent properties of GaN‐based materials can be practically used in the UHV field? Here, UHV AlGaN/GaN SBDs are demonstrated on sapphire with a BV of 10.6 kV, a specific on‐resistance (RON,SP) of 25.8 mΩ cm2, yielding a power figure‐of‐merit (P‐FOM = BV2/RON,SP) of 4.35 GW cm−2. These devices are designed with single channel and 85‐µm anode‐to‐cathode spacing, without other additional electric field management, demonstrating its great potential for the UHV application in power electronics.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: GaN-based semiconductor devices and materials · Ga2O3 and related materials · Metal and Thin Film Mechanics

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

The Key Laboratory of Advanced Photonic and Electronic Materials School of Electronic Science and Engineering Nanjing University Nanjing 210033 P. R. China

Corenergy Semiconductor Incorporation Suzhou 215600 P. R. China

Enkris Semiconductor Inc NW‐20, Nanopolis Suzhou 215000 P. R. China

References (44)

Show source-provided references
1. 10.1109/LED.2015.247517810.1109/LED.2015.2475178 ↗
2. 10.1109/LED.2015.249926710.1109/LED.2015.2499267 ↗
3. 10.1109/LED.2018.283099810.1109/LED.2018.2830998 ↗
4. Zhang T. · IEEE Electron Device Lett. · 2018 · 39 · 1548
5. 10.1109/LED.2019.293331410.1109/LED.2019.2933314 ↗
6. 10.1109/LED.2015.240430910.1109/LED.2015.2404309 ↗
7. 10.1109/LED.2013.226947510.1109/LED.2013.2269475 ↗
8. 10.1109/LED.2013.226793310.1109/LED.2013.2267933 ↗
9. 10.1109/LED.2012.223540310.1109/LED.2012.2235403 ↗
10. 10.1109/TED.2013.227912010.1109/TED.2013.2279120 ↗
11. 10.1063/1.134662210.1063/1.1346622 ↗
12. Park K. · 2011
13. 10.1109/LED.2017.278390810.1109/LED.2017.2783908 ↗
14. Kamada A. · 2008
15. Lee S. C. · 2005
16. 10.1109/LED.2015.243217110.1109/LED.2015.2432171 ↗
17. 10.1002/pssc.20110034310.1002/pssc.201100343 ↗
18. 10.1109/LED.2011.216461010.1109/LED.2011.2164610 ↗
19. 10.1109/LED.2011.217928110.1109/LED.2011.2179281 ↗
20. 10.1109/LED.2018.288719910.1109/LED.2018.2887199 ↗
21. 10.1109/TED.2013.227327110.1109/TED.2013.2273271 ↗
22. 10.1049/el.2014.039210.1049/el.2014.0392 ↗
23. Longobardi G. · 2017 · 227
24. 10.1109/LED.2012.220087410.1109/LED.2012.2200874 ↗
25. 10.1109/LED.2010.209582510.1109/LED.2010.2095825 ↗
26. Vetury R. · 1998 · 55
27. 10.1109/LED.2006.88102010.1109/LED.2006.881020 ↗
28. Ishida H. · 2008 · 1
29. 10.1016/j.sse.2018.10.00910.1016/j.sse.2018.10.009 ↗
30. Jiang Y. F. · 2016 · 43
31. 10.1109/TPEL.2017.272360110.1109/TPEL.2017.2723601 ↗
32. 10.1109/LED.2021.307680210.1109/LED.2021.3076802 ↗
33. 10.1016/j.sse.2020.10795310.1016/j.sse.2020.107953 ↗
34. 10.1109/LED.2020.304908610.1109/LED.2020.3049086 ↗
35. 10.1109/JEDS.2020.298075910.1109/JEDS.2020.2980759 ↗
36. 10.1149/05003.0211ecst10.1149/05003.0211ecst ↗
37. 10.1080/02564602.2018.145065210.1080/02564602.2018.1450652 ↗
38. 10.1063/1.488569510.1063/1.4885695 ↗
39. 10.1016/j.jcrysgro.2006.10.19210.1016/j.jcrysgro.2006.10.192 ↗
40. 10.1109/LED.2010.205258710.1109/LED.2010.2052587 ↗
41. 10.1088/0256-307X/29/7/07850110.1088/0256-307X/29/7/078501 ↗
42. 10.1063/1.131160510.1063/1.1311605 ↗
43. 10.1063/1.143002410.1063/1.1430024 ↗
44. Kamada A. · 2008 · 225