High‐Aspect‐Ratio Imageable Top‐Surface Lithography Using UV‐Assisted Inkless Contact Printing
Source abstract
Abstract
The simple production of micro/nanoscale patterns with very high aspect ratios exceeding that of the mold used is demonstrated using unconventional top-surface lithography. The method combines inkless contact printing and subsequent dry pattern development by oxygen reactive ion etching (see image), making it possible to form high-resolution, high-aspect-ratio patterns without the aid of expensive optical protocols.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Nanofabrication and Lithography Techniques · Advancements in Photolithography Techniques · Microfluidic and Capillary Electrophoresis Applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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