DataVXSmallPaper
journal article·2018-11Open access

Epidermal Electronics: Wireless, Battery‐Free Epidermal Electronics for Continuous, Quantitative, Multimodal Thermal Characterization of Skin (Small 47/2018)

Siddharth R. Krishnan, Chun‐Ju Su, Zhaoqian Xie, Manish Patel, Surabhi R. Madhvapathy, Yeshou Xu, Juliet Freudman, Barry Ng, Seung Yun Heo, Heling Wang, Tyler R. Ray, John Leshock, Izabela Stankiewicz, Xue Feng, Yonggang Huang, Philipp Gutruf, John A. Rogers

Small· Volume 14· Issue 47
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Source abstract

Abstract

In article number 1803192, Philipp Gutruf, John A. Rogers, and co-workers present a soft, miniaturized, battery-free, near-field communication-based sensor that measures the temperature and thermal transport properties of the skin. The wireless epidermal device yields continuous data streams over extended periods of wear with measurements of skin hydration, blood perfusion, and rates of healing after trauma.
Source: openalex_inverted_index · Quality: baseline

Research context

Energy storage

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials

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Affiliations

Department of Materials Science and Engineering Frederick Seitz Materials Research Laboratory University of Illinois at Urbana‐Champaign Urbana IL 61801 USA

Simpson Querrey Institute for BioNanotechnology Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA

Department of Materials Science and Engineering Simpson Querrey Institute for BioNanotechnology Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA

Department of Civil and Environmental Engineering Mechanical Engineering Materials Science and Engineering Northwestern University Evanston IL 60208 USA

Key Laboratory of C&PC Structures of the Ministry of Education Southeast University Nanjing 210096 China

Department of Biomedical Engineering Simpson Querrey Institute for BioNanotechnology Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA

AML Department of Engineering Mechanics Center for Mechanics and Materials Tsinghua University Beijing 100084 China

Department of Civil and Environmental Engineering Mechanical Engineering Materials Science and Engineering Center of Bio‐integrated electronics Northwestern University Evanston IL 60208 USA

Department of Biomedical Engineering University of Arizona Tucson AZ 85721 USA

Department of Materials Science and Engineering Biomedical Engineering, Chemistry Mechanical Engineering Electrical Engineering and Computer Science and Neurological Surgery McCormick School of Engineering and Feinberg School of Medicine Simpson Querrey Institute for BioNanotechnology Center for Bio‐Integrated Electronics Northwestern University Evanston IL 60208 USA

References

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