Polyethylene Glycol as a Novel Resist and Sacrificial Material for Generating Positive and Negative Nanostructures

One material for two purposes: Poly(ethylene glycol) is used as a novel etch resist to generate both raised and recessed nanoscale solid-state structures (see image). This novel resist is inexpensive, easy to use, and affords sub-100-nm resolution. Supporting information for this article is available on the WWW under http://www.wiley-vch.de/contents/jc_2296/2008/smll200701089_s.pdf or from the author. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.