Electrocatalytic Microdevice Array Based on Wafer‐Scale Conductive Metal‐Organic Framework Thin Film for Massive Hydrogen Production

Abstract The synthesis of large‐scale 2D conductive metal‐organic framework films with tunable thickness is highly desirable but challenging. In this study, an Interface Confinement Self‐Assembly Pulling (ICSP) method for in situ synthesis of 4‐in. Ni‐BHT film on the substrate surface is developed. By modulating the thickness of the confined space, the thickness of Ni‐BHT films could be easily varied from 4 to 42 nm. To eliminate interference factors and evaluate the effect of film thickness on the catalytic performance of HER, an electrocatalytic microdevice based on the Ni‐BHT film is designed. The effective catalytic thickness of the Ni‐BHT film is found to be around 32 nm. Finally, to prepare the electrocatalytic microdevice array, over 100 000 microdevices on a 4‐in. Ni‐BHT film are integrated. The results show that the microdevice array has good stability and a high hydrogen production rate and could be used to produce large amounts of hydrogen. The wafer‐scale 2D conductive metal‐organic framework's fabrication greatly advances the practical application of microdevices for massive hydrogen production.