A Platform for Electric Field Aided and Wire‐Guided Droplet Manipulation

Small droplets can be manipulated based on controlling the adhesion work to a hydrophobic wire. The wire can be used to pick up, transport, and lay down droplets with volumes between picoliters to microliters avoiding the sliding of droplets over chip surfaces. Handling of droplets on surfaces with large steps such as engraved wells or channels is possible. As a service to our authors and readers, this journal provides supporting information supplied by the authors. Such materials are peer reviewed and may be re-organized for online delivery, but are not copy-edited or typeset. Technical support issues arising from supporting information (other than missing files) should be addressed to the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.