journal article·2005-01Open access

Cover Picture: Top‐Down Meets Bottom‐Up: Dip‐Pen Nanolithography and DNA‐Directed Assembly of Nanoscale Electrical Circuits (Small 1/2005)

Sung‐Wook Chung, David S. Ginger, Mark W. Morales, Zhengfan Zhang, Venkat Chandrasekhar, Mark A. Ratner, Chad A. Mirkin

Small· Volume 1· Issue 1

Abstract

The cover picture shows a schematic representation of a nanoscale tunnel junction circuit formed when a DNA‐functionalized gold nanoparticle is directed between two metallic electrodes (a field‐emission SEM image is shown in the inset). The background displays an electron microscopy image of a device containing such junctions for potential use as a biosensor. Such a combination of biology, chemistry, engineering, and materials science serves as a model for the interdisciplinary character that Small exemplifies. For more information, please refer to the Communication by C. A. Mirkin and co‐workers on page 64 ff. The authors thank Yeechi Chen for the cover design.
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Research context

OpenAlex topics: Advanced biosensing and bioanalysis techniques · Nanofabrication and Lithography Techniques · Molecular Junctions and Nanostructures

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References

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