Reflow and Electrical Characteristics of Nanoscale Solder
Source abstract
Abstract
Soldering nanojoints: Nanowires with a diameter range of 30–200 nm were patterned with solder segments, and the reflow of the solder on these wires was investigated (see Figure). Low-resistance ohmic contacts were observed across solder joints after reflow. Corrosion, oxidation, and intermetallic diffusion play a crucial role in solder reflow and joint formation at the nanoscale.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Molecular Junctions and Nanostructures · Nanowire Synthesis and Applications · Force Microscopy Techniques and Applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (26)
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