Aerosol Printing of 3D Conductive Microstructures via Precision Dot Modulation

Abstract The advancement of electronic devices necessitates the fabrication of high‐precision, 3D conductive microstructures using functional materials. This study introduces an improved pneumatic shuttering method for aerosol printing (AP), enabling the fabrication of 3D microstructures. The approach overcomes the limitations of conventional AP techniques, which struggle to print dot‐based structures essential for constructing intricate 3D geometries layer by layer. To address this challenge, a pneumatic shuttering mechanism based on flow‐path control is developed, enabling rapid on–off jet for both line and dot printing. This technique allows precise dot modulation (ranging from 20 to 144 µm), facilitating high‐resolution and scalable patterning. Leveraging this capability, an analog halftoning technique is implemented, enabling precise control of the deposition of functional materials. Additionally, the method supports the fabrication of complex 3D microstructures, including conductive pillars with customizable angles relative to the substrate. These pillars serve as interconnects for chips with uneven surfaces, effectively addressing challenges associated with large height variations. This advancement in AP technology significantly enhances deposition precision and patterning flexibility, broadening its potential for advanced material applications in next‐generation electronics and additive manufacturing.