journal article·2025-04Open access

An In Vivo Biostability Evaluation of ALD and Parylene‐ALD Multilayers as Micro‐Packaging Solutions for Small Single‐Chip Implants

Kambiz Nanbakhsh, Matthias Van Gompel, Riina Ritasalo, Astrid Gollhardt, Domonkos Horváth, Kinga Tóth, Domokos Meszéna, István Ulbert, Wouter Serdijn, Vasiliki Giagka

Small· Volume 21· Issue 16

Abstract

Abstract Miniaturization of next‐generation active neural implants requires novel micro‐packaging solutions that can maintain their long‐term coating performance in the body. This work presents two thin‐film coatings and evaluates their biostability and in vivo performance over a 7‐month animal study. To evaluate the coatings on representative surfaces, two silicon microchips with different surface microtopography are used. Microchips are coated with either a ≈100 nm thick inorganic hafnium‐based multilayer deposited via atomic layer deposition (ALD‐ML), or a ≈6 µm thick hybrid organic–inorganic Parylene C and titanium‐based ALD multilayer stack (ParC‐ALD‐ML). After 7 months of direct exposure to the body environment, the multilayer coatings are evaluated using optical and cross‐sectional scanning electron microscopy. Time‐of‐flight secondary ion mass spectrometry (ToF‐SIMS) is also used to evaluate the chemical stability and barrier performance of the layers after long‐term exposure to body media. Results showed the excellent biostability of the 100 nm ALD‐ML coating with no ionic penetration within the layer. For the ParC‐ALD‐ML, concurrent surface degradation and ion ingress are detected within the top ≈70 nm of the outer Parylene C layer. The results and evaluation techniques presented here can enable future material selection, packaging, and analysis, enhancing the functional stability of future chip‐embedded neural implants.
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Research context

OpenAlex topics: Neuroscience and Neural Engineering · Advanced Memory and Neural Computing · Conducting polymers and applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Microelectronics Faculty of Electrical Engineering Mathematics and Computer Science Delft University of Technology Delft 2628 CN The Netherlands

Comelec SA La Chaux‐de‐Fonds 2301 Switzerland

Applied Materials, Finland Masalantie 365 Masala 02430 Finland

Department of Environmental & Reliability Engineering Fraunhofer Institute for Reliability and Microintegration IZM 13355 Berlin Germany

Research Centre for Natural Sciences Institute of Cognitive Neuroscience and Psychology HUN‐REN Budapest 1117 Hungary

Faculty of Information Technology and Bionics Pazmany Peter Catholic University Budapest 1083 Hungary

Department of Neurosurgery and Neurointervention Faculty of Medicine Semmelweis University Amerikai út 57 Budapest 1145 Hungary

Department of Neuroscience Erasmus Medical Center Rotterdam 3015 GD The Netherlands

Department of System Integration and Interconnection Technologies Fraunhofer Institute for Reliability and Microintegration IZM 13355 Berlin Germany

Funding

Electronic Components and Systems for European Leadership · Hungarian Science Foundation · Hungarian Scientific Research Fund

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