Source abstract
Abstract
Abstract With the advancement of electronics, there is a growing need to effectively combine rigid, flexible, and stretchable materials to build hybrid electronics. However, the interfacial transition between rigid/flexible and stretchable substrates presents considerable challenges, mainly due to differences in elastic moduli, complicating their integration for practical usage. Here, bioinspired omnidirectional interfacial‐engineered flexible islands (BOIEFI) are introduced for a robust transition from flexible to stretchable substrates. These BOIEFIs enable the creation of highly stretchable and durable hybrid substrates capable of withstanding diverse physical deformations such as stretching, twisting, and even poking. Inspired by plant roots, BOIEFIs are designed with primary and secondary root structures that provide flexible mechanical interlocking between substrates with different elastic moduli. Through experimental and computational methods, optimized BOIEFIs exhibit significantly enhanced stretchability and improved fatigue life. To demonstrate the broad applicability, light‐emitting diodes (LEDs) are integrated into BOIEFIs to establish a stretchable display. In addition, a human‐machine interface device with soft pressure sensors and an LED array is fabricated for the implementation of hybrid electronics. This approach facilitates the harmonious integration of rigid, flexible, and stretchable substrates, leading to the creation of soft, highly stretchable, and durable hybrid electronics.
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Affiliations
Department of Mechanical Engineering Korea Advanced Institute of Science and Technology (KAIST) 291 Daehak‐ro, Daejeon Yuseong‐gu 34141 Republic of Korea
Intelligent Components and Sensors Research Section Electronics and Telecommunication Research Institute (ETRI) 218 Gajeong‐ro, Daejeon Yuseong‐gu 34129 Republic of Korea
Department of Control and Instrumentation Engineering Korea University Sejong 30019 Republic of Korea
Department of Advanced Device Technology University of Science and Technology Daejeon 34113 Republic of Korea
Funding
National Research Foundation of Korea