Realizing the Accurate Measurements of Thermal Conductivity over a Wide Range by Scanning Thermal Microscopy Combined with Quantitative Prediction of Thermal Contact Resistance

Abstract Quantitative thermal performance measurements and thermal management at the micro‐/nano scale are becoming increasingly important as the size of electronic components shrinks. Scanning thermal microscopy (SThM) is an emerging method with high spatial resolution that accurately reflects changes in local thermal signals based on a thermally sensitive probe. However, because of the unclear thermal resistance at the probe‐sample interface, quantitative characterization of thermal conductivity for different kinds of materials still remains limited. In this paper, the heat transfer process considering the thermal contact resistance between the probe and sample surface is analyzed using finite element simulation and thermal resistance network model. On this basis, a mathematical empirical function is developed applicable to a variety of material systems, which depicts the relationship between the thermal conductivity of the sample and the probe temperature. The proposed model is verified by measuring ten materials with a wide thermal conductivity range, and then further validated by two materials with unknown thermal conductivity. In conclusion, this work provides the prospect of achieving quantitative characterization of thermal conductivity over a wide range and further enables the mapping of local thermal conductivity to microstructures or phases of materials.